Thermal - Thermoelectric, Peltier Modules

Image Part Number Description / PDF Quantity Rfq
387004688

387004688

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

0

108161050002

108161050002

Laird Thermal Systems

PC5,161,F1,4040,TA,RT,W6

131

430581-503

430581-503

Laird Thermal Systems

PELTIR ET20,30,F2A,0610,GG,W2.25

40

56430-501

56430-501

Laird Thermal Systems

PELTIER MOD CP10,63,05,L1,W4.5

220

430013-501

430013-501

Laird Thermal Systems

PELTIER OT15,66,F0,1211,11,W2.25

5

430052-501

430052-501

Laird Thermal Systems

PELTIER MOD 43.9X39.9X3.63MM

17

430265-510

430265-510

Laird Thermal Systems

PELTIER OT20,66,F0,1211,11,E,WS

0

430160-502

430160-502

Laird Thermal Systems

PELTIER MOD HT8,12,F2,4040,TA,W6

1

387004685

387004685

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

8

430278-508

430278-508

Laird Thermal Systems

OT20,32,F0,0808,11,RT,W2.25

33

387004946

387004946

Laird Thermal Systems

ETX4-3-F1-2020-TA-RT-W6

0

387004715

387004715

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

0

7950003-603

7950003-603

Laird Thermal Systems

ZT6-12-F1-4040-TA-EP-W8

10

387004983

387004983

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

0

387001842

387001842

Laird Thermal Systems

ET9,31,F1,3030,TA,RT,W6

0

430540-501

430540-501

Laird Thermal Systems

PELTIR ET19,23,F1N,0608,11,W2.24

12

56760-500

56760-500

Laird Thermal Systems

PELTIER CP14,127,06,L1,RT,W4.5

9

7945002-601

7945002-601

Laird Thermal Systems

PELTIER MOD ZT5,16,F1,4040,TA,W8

56

64979-501

64979-501

Laird Thermal Systems

PELTIER MOD CP2,127,10,L1,W4.5

43

71020-505

71020-505

Laird Thermal Systems

PELTIER SH14,125,045,L1,W4.5

4

Thermal - Thermoelectric, Peltier Modules

1. Overview

Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Standard TEMsBalanced cooling capacity and costIndustrial temperature control systems
High-Power TEMsHigh T (temperature difference) and large heat pumping capacityLaser diode cooling, power electronics
Microminiature TEMsSub-centimeter dimensions with precise thermal regulationMedical sensors, infrared detectors
Multistage TEMsCascaded design for ultra-low temperature applicationsCryogenic systems, scientific instruments

3. Structure and Components

A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi2Te3 based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)

4. Key Technical Specifications

ParameterDescriptionImportance
Qmax (W)Maximum heat pumping capacityDetermines cooling capability
Tmax ( C)Maximum temperature differenceDefines operational limits
Imax (A)Maximum operating currentImpacts power consumption
ZT ValueThermoelectric figure of meritMaterial efficiency indicator
Dimensions (mm)Physical sizeIntegration constraints

5. Application Fields

Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Laird Thermal SystemsHiTemp Series Tmax=72 C, 200W capacity
TE ConnectivityCP Series TECMiniature 10 10mm footprint
II-VI IncorporatedLaser Diode CoolerHigh-reliability multistage design

7. Selection Recommendations

Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs

8. Industry Trends

Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries

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