Thermal - Thermoelectric, Peltier Modules

Image Part Number Description / PDF Quantity Rfq
2CP040080-7-2L

2CP040080-7-2L

Laird Thermal Systems

THERMOELECTRIC

0

6CP055065-127-71-31-17-7-2L

6CP055065-127-71-31-17-7-2L

Laird Thermal Systems

THERMOELECTRIC

0

430236-500

430236-500

Laird Thermal Systems

CP2-127-10-L2-W4.5

0

HT6-6-21X43

HT6-6-21X43

Laird Thermal Systems

THERMOELECT

0

ET2.0-18-F2A

ET2.0-18-F2A

Laird Thermal Systems

THERMOELECT

0

2SC040050-127-63L

2SC040050-127-63L

Laird Thermal Systems

THERMOELECTRIC

0

OT2.0-17-F1A

OT2.0-17-F1A

Laird Thermal Systems

THERMOELECT

0

4CP040080-127-71-31-17L

4CP040080-127-71-31-17L

Laird Thermal Systems

THERMOELECTRIC

0

2OT1.4-24-F9

2OT1.4-24-F9

Laird Thermal Systems

THERMOELECTRIC

0

CP1.0-7-05L

CP1.0-7-05L

Laird Thermal Systems

THERMOELECT

0

430553-502

430553-502

Laird Thermal Systems

ET20,65,F2A,1312,11,W2.25

0

PT8-7-30

PT8-7-30

Laird Thermal Systems

THERMOELECT

0

OT1.2-30-F2A

OT1.2-30-F2A

Laird Thermal Systems

THERMOELECT

0

430892-420

430892-420

Laird Thermal Systems

PELTIER

0

SH1.4-15-10L

SH1.4-15-10L

Laird Thermal Systems

THERMOELECT

0

UT4-12-30-F1

UT4-12-30-F1

Laird Thermal Systems

THERMOELECT

0

4CP040080-31-17-7-2L

4CP040080-31-17-7-2L

Laird Thermal Systems

THERMOELECTRIC

0

6CP040065-127-71-31-17-7-2L

6CP040065-127-71-31-17-7-2L

Laird Thermal Systems

THERMOELECTRIC

0

UT6-7-30-F1

UT6-7-30-F1

Laird Thermal Systems

THERMOELECT

0

ET1.5-62-F3

ET1.5-62-F3

Laird Thermal Systems

THERMOELECT

0

Thermal - Thermoelectric, Peltier Modules

1. Overview

Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Standard TEMsBalanced cooling capacity and costIndustrial temperature control systems
High-Power TEMsHigh T (temperature difference) and large heat pumping capacityLaser diode cooling, power electronics
Microminiature TEMsSub-centimeter dimensions with precise thermal regulationMedical sensors, infrared detectors
Multistage TEMsCascaded design for ultra-low temperature applicationsCryogenic systems, scientific instruments

3. Structure and Components

A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi2Te3 based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)

4. Key Technical Specifications

ParameterDescriptionImportance
Qmax (W)Maximum heat pumping capacityDetermines cooling capability
Tmax ( C)Maximum temperature differenceDefines operational limits
Imax (A)Maximum operating currentImpacts power consumption
ZT ValueThermoelectric figure of meritMaterial efficiency indicator
Dimensions (mm)Physical sizeIntegration constraints

5. Application Fields

Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Laird Thermal SystemsHiTemp Series Tmax=72 C, 200W capacity
TE ConnectivityCP Series TECMiniature 10 10mm footprint
II-VI IncorporatedLaser Diode CoolerHigh-reliability multistage design

7. Selection Recommendations

Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs

8. Industry Trends

Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries

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