Thermal - Thermoelectric, Peltier Modules

Image Part Number Description / PDF Quantity Rfq
3CP040065-127-71-31L

3CP040065-127-71-31L

Laird Thermal Systems

THERMOELECTRIC

0

430533-503

430533-503

Laird Thermal Systems

THERMOELECT

0

2OT0.6-83-F9

2OT0.6-83-F9

Laird Thermal Systems

THERMOELECTRIC

0

RH1.4-32-10L

RH1.4-32-10L

Laird Thermal Systems

THERMOELECT

0

UT4-12-30-F2

UT4-12-30-F2

Laird Thermal Systems

THERMOELECT

0

UT6-12-40-F2

UT6-12-40-F2

Laird Thermal Systems

THERMOELECT

0

2SC085065-127-70L

2SC085065-127-70L

Laird Thermal Systems

THERMOELECTRIC

0

430854-614

430854-614

Laird Thermal Systems

UT8-200-F2-4040-TA-EP-WCON

0

OT2.0-65-F2A

OT2.0-65-F2A

Laird Thermal Systems

THERMOELECT

0

108161050003

108161050003

Laird Thermal Systems

PC5-16-F1-4040-TA-W6

0

ET1.2-31-F1A

ET1.2-31-F1A

Laird Thermal Systems

THERMOELECT

0

OT1.2-31-F1

OT1.2-31-F1

Laird Thermal Systems

THERMOELECT

0

OT1.2-65-F2A

OT1.2-65-F2A

Laird Thermal Systems

THERMOELECT

0

430892-415

430892-415

Laird Thermal Systems

PELTIER

0

CP5-31-10L

CP5-31-10L

Laird Thermal Systems

THERMOELECT

0

ET2.0-31-F2A

ET2.0-31-F2A

Laird Thermal Systems

THERMOELECT

0

OT1.2-31-F1A

OT1.2-31-F1A

Laird Thermal Systems

THERMOELECT

0

5CP040065-127-71-31-17-7L

5CP040065-127-71-31-17-7L

Laird Thermal Systems

THERMOELECTRIC

0

430764-504

430764-504

Laird Thermal Systems

UT15-12-F2-4040-TB-W6

0

4CP055065-127-71-31-17L

4CP055065-127-71-31-17L

Laird Thermal Systems

THERMOELECTRIC

0

Thermal - Thermoelectric, Peltier Modules

1. Overview

Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Standard TEMsBalanced cooling capacity and costIndustrial temperature control systems
High-Power TEMsHigh T (temperature difference) and large heat pumping capacityLaser diode cooling, power electronics
Microminiature TEMsSub-centimeter dimensions with precise thermal regulationMedical sensors, infrared detectors
Multistage TEMsCascaded design for ultra-low temperature applicationsCryogenic systems, scientific instruments

3. Structure and Components

A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi2Te3 based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)

4. Key Technical Specifications

ParameterDescriptionImportance
Qmax (W)Maximum heat pumping capacityDetermines cooling capability
Tmax ( C)Maximum temperature differenceDefines operational limits
Imax (A)Maximum operating currentImpacts power consumption
ZT ValueThermoelectric figure of meritMaterial efficiency indicator
Dimensions (mm)Physical sizeIntegration constraints

5. Application Fields

Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Laird Thermal SystemsHiTemp Series Tmax=72 C, 200W capacity
TE ConnectivityCP Series TECMiniature 10 10mm footprint
II-VI IncorporatedLaser Diode CoolerHigh-reliability multistage design

7. Selection Recommendations

Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs

8. Industry Trends

Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries

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