Thermal - Thermoelectric, Peltier Modules

Image Part Number Description / PDF Quantity Rfq
430032-502

430032-502

Laird Thermal Systems

PELTIER CP14,71,045,L1,RT,W4.5

41

387004953

387004953

Laird Thermal Systems

ETX4-3-F1-1515-TA-EP-W6

0

387001741

387001741

Laird Thermal Systems

ET2.5,12,F1,3030,TA,RT,W4.5

0

430165-507

430165-507

Laird Thermal Systems

PELTIER CP2,71,06,L1,RT,W4.5

12

430857-501

430857-501

Laird Thermal Systems

PELTIER UT15,288,F2,5252,TA,RTW6

237

9320004-304

9320004-304

Laird Thermal Systems

PELTIR MS2,024,06,06,11,11,00,W2

4

7950002-601

7950002-601

Laird Thermal Systems

PELTIER MOD ZT8,12,F1,4040,TA,W8

3

387004937

387004937

Laird Thermal Systems

ETX6-19-F1-4040-TA-RT-W6

0

430028-513

430028-513

Laird Thermal Systems

PELTIER HT4,6,F2,2143,TA,RT,W6

34

387004945

387004945

Laird Thermal Systems

ETX2-12-F2-3030-TA-RT-W6

18

16506-302

16506-302

Laird Thermal Systems

PELTIR MS2,102,22,22,17,17,11,W8

8

430548-503

430548-503

Laird Thermal Systems

ET20,68,F1A,1313,GG,W2.25

0

475089-304

475089-304

Laird Thermal Systems

PELTIR MS2,068,14,14,15,15,00,W8

75

430701-504

430701-504

Laird Thermal Systems

ET19,35,F1N,0612,11,RT,W2.25

8

387004933

387004933

Laird Thermal Systems

ETX3-48-F1-1212-GG-W6

0

430687-504

430687-504

Laird Thermal Systems

ET12,65,F2A,1312,TB,W2.25

2

57040-500

57040-500

Laird Thermal Systems

PELTIER CP2,71,10,L1,W4.5

35

71020-513

71020-513

Laird Thermal Systems

SH14,125,045,L1,EP,W4.5

10

430801-504

430801-504

Laird Thermal Systems

PELTIER MOD CP10,31,05,L1,W4.5

503

430274-501

430274-501

Laird Thermal Systems

PELTIER OT12,62,F3,1211,11,W2.25

0

Thermal - Thermoelectric, Peltier Modules

1. Overview

Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Standard TEMsBalanced cooling capacity and costIndustrial temperature control systems
High-Power TEMsHigh T (temperature difference) and large heat pumping capacityLaser diode cooling, power electronics
Microminiature TEMsSub-centimeter dimensions with precise thermal regulationMedical sensors, infrared detectors
Multistage TEMsCascaded design for ultra-low temperature applicationsCryogenic systems, scientific instruments

3. Structure and Components

A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi2Te3 based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)

4. Key Technical Specifications

ParameterDescriptionImportance
Qmax (W)Maximum heat pumping capacityDetermines cooling capability
Tmax ( C)Maximum temperature differenceDefines operational limits
Imax (A)Maximum operating currentImpacts power consumption
ZT ValueThermoelectric figure of meritMaterial efficiency indicator
Dimensions (mm)Physical sizeIntegration constraints

5. Application Fields

Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Laird Thermal SystemsHiTemp Series Tmax=72 C, 200W capacity
TE ConnectivityCP Series TECMiniature 10 10mm footprint
II-VI IncorporatedLaser Diode CoolerHigh-reliability multistage design

7. Selection Recommendations

Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs

8. Industry Trends

Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries

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