Thermal - Thermoelectric, Peltier Modules

Part Number	Description / PDF	Quantity
CP39301536H CUI Devices	PELTIER, 30 X 15 X 3.6 MM, 3.9 A	161
CP30338 CUI Devices	PELTIER MOD 30 X 3.8MM 3.0A INP	379
CP185039 CUI Devices	PELTIER, 50 X 50 X 3.9, 18 A, WI	13
CP40136 CUI Devices	PELTIER MOD 15 X 3.6MM 4.0A INP	218
CP0734-238 CUI Devices	PELTIER, 3.4 X 3.4 X 2.38 MM, 0.	120
CP203475H CUI Devices	PELTIER, 30 X 30 X 4.75 MM, 2 A,	0
CP394044365 CUI Devices	PELTIER, 40 X 44 X 3.65, 3.9 A,	19
CP20301547H CUI Devices	PELTIER, 30 X 15 X 4.7 MM, 2.0 A	0
CP39234030H CUI Devices	PELTIER, 23 X 40 X 3 MM, 3.9 A,	150
CP30239H CUI Devices	PELTIER, 20 X 20 X 3.9 MM, 3.0 A	73
CP40447 CUI Devices	PELTIER, 40 X 40 X 4.7 MM, 4 A,	20
CP604040 CUI Devices	PELTIER, 40 X 40 X 4, 6 A, WIRE	147
CP6030395 CUI Devices	PELTIER, 30 X 30 X 3.95, 6 A, WI	59
CP85438 CUI Devices	PELTIER MOD 40 X 3.8MM 8.5A INP	3066
CP15535 CUI Devices	PELTIER, 50 X 50 X 3.75 MM, 15 A	0

Thermal - Thermoelectric, Peltier Modules

1. Overview

Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Standard TEMs	Balanced cooling capacity and cost	Industrial temperature control systems
High-Power TEMs	High T (temperature difference) and large heat pumping capacity	Laser diode cooling, power electronics
Microminiature TEMs	Sub-centimeter dimensions with precise thermal regulation	Medical sensors, infrared detectors
Multistage TEMs	Cascaded design for ultra-low temperature applications	Cryogenic systems, scientific instruments

3. Structure and Components

A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi₂Te₃ based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)

4. Key Technical Specifications

Parameter	Description	Importance
Q_max (W)	Maximum heat pumping capacity	Determines cooling capability
T_max ( C)	Maximum temperature difference	Defines operational limits
I_max (A)	Maximum operating current	Impacts power consumption
ZT Value	Thermoelectric figure of merit	Material efficiency indicator
Dimensions (mm)	Physical size	Integration constraints

5. Application Fields

Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Laird Thermal Systems	HiTemp Series	T_max=72 C, 200W capacity
TE Connectivity	CP Series TEC	Miniature 10 10mm footprint
II-VI Incorporated	Laser Diode Cooler	High-reliability multistage design

7. Selection Recommendations

Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs

8. Industry Trends

Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries