Thermal - Thermoelectric, Peltier Modules

Part Number	Description / PDF	Quantity
CP1062-268P CUI Devices	PELTIER, 6.2 X 6.2 X 2.9 MM, 1 A	59
CP10205033 CUI Devices	PELTIER, 20 X 50 X 3.3 MM, 10 A,	94
CP60231H CUI Devices	PELTIER, 20 X 20 X 3.1 MM, 6 A,	34
CP60140 CUI Devices	PELTIER MOD 15 X 4MM 6.0A INP	3359
CP454375 CUI Devices	PELTIER, 40 X 40 X 3.75, 4.5 A,	44
CP2088-219 CUI Devices	PELTIER, 8.8 X 8.8 X 2.19 MM, 2	47
CP60333 CUI Devices	PELTIER MOD 30 X 3.3MM 6.0A INP	780
CP85338 CUI Devices	PELTIER MOD 30 X 3.8MM 8.5A INP	62
CP2020405H CUI Devices	PELTIER, 20 X 20 X 4.05 MM, 2 A,	232
CP852040345H CUI Devices	PELTIER, 20 X 40 X 3.45 MM, 8.5	44
CP1054033H CUI Devices	PELTIER, 40 X 40 X 3.3 MM, 10.5	36
CP70237 CUI Devices	PELTIER, 20 X 20 X 3.8 MM, 7 A,	0
CP60404567H-2 CUI Devices	PELTIER, 40. X 45 X 6.7 MM, 6.0	18
CP60139H CUI Devices	PELTIER, 15 X 15 X 3.9 MM, 6 A,	28
CP35447 CUI Devices	PELTIER, 40 X 40 X 4.8 MM, 3.5 A	35
CP60340 CUI Devices	PELTIER MOD 30 X 4MM 6.0A INP	131
CP902015343H CUI Devices	PELTIER, 20 X 15 X 3.43 MM, 9 A,	273
CP3495-46 CUI Devices	PELTIER, 9.5 X 9.5 X 4.6 MM, 3.4	55
CP081030-M CUI Devices	PELTIER, 10 X 10 X 3 MM, 0.8 A,	117
CP073450-238 CUI Devices	PELTIER, 3.4 X 5 X 2.38 MM, 0.7	57

Thermal - Thermoelectric, Peltier Modules

1. Overview

Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Standard TEMs	Balanced cooling capacity and cost	Industrial temperature control systems
High-Power TEMs	High T (temperature difference) and large heat pumping capacity	Laser diode cooling, power electronics
Microminiature TEMs	Sub-centimeter dimensions with precise thermal regulation	Medical sensors, infrared detectors
Multistage TEMs	Cascaded design for ultra-low temperature applications	Cryogenic systems, scientific instruments

3. Structure and Components

A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi₂Te₃ based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)

4. Key Technical Specifications

Parameter	Description	Importance
Q_max (W)	Maximum heat pumping capacity	Determines cooling capability
T_max ( C)	Maximum temperature difference	Defines operational limits
I_max (A)	Maximum operating current	Impacts power consumption
ZT Value	Thermoelectric figure of merit	Material efficiency indicator
Dimensions (mm)	Physical size	Integration constraints

5. Application Fields

Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Laird Thermal Systems	HiTemp Series	T_max=72 C, 200W capacity
TE Connectivity	CP Series TEC	Miniature 10 10mm footprint
II-VI Incorporated	Laser Diode Cooler	High-reliability multistage design

7. Selection Recommendations

Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs

8. Industry Trends

Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries