Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
COH-1019LVC-400-10-1NT

COH-1019LVC-400-10-1NT

Taica Corporation

THERMAL INTERFACE PAD, GAP PAD,

0

35MM-35MM-25-8810

35MM-35MM-25-8810

3M

THERM PAD 35MMX35MM 1=25PK

0

36.8MM-36.8MM-25-8810

36.8MM-36.8MM-25-8810

3M

THERM PAD 36.8MMX36.8MM 1=25/PK

0

TG-A486C-320-320-0.3-2A

TG-A486C-320-320-0.3-2A

t-Global Technology

THERM PAD 320MMX320MM W/ADH GRAY

0

T62-100-100-0.13

T62-100-100-0.13

t-Global Technology

THERM PAD 100MMX100MM BLACK

0

DC0022/01-TI900-0.12-2A

DC0022/01-TI900-0.12-2A

t-Global Technology

THERM PAD 57.15MMX44.45MM W/ADH

0

A17916-08

A17916-08

Laird - Performance Materials

TFLEX B280 9X9IN

455

25.4MM-12.7MM-25-8810

25.4MM-12.7MM-25-8810

3M

THERM PAD 25.4MMX12.7MM 1=25/PK

0

EYG-A121801PM

EYG-A121801PM

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

5

TG-A3500F-160-160-3.0

TG-A3500F-160-160-3.0

t-Global Technology

THERMAL PAD 160X160MM YELLOW

3

DC0011/15-TG-A482K-0.1-0

DC0011/15-TG-A482K-0.1-0

t-Global Technology

THERM PAD 21.84MM X 18.79MM RED

0

EYG-A091202M

EYG-A091202M

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

8

TG-A4500-325-325-3.0

TG-A4500-325-325-3.0

t-Global Technology

SILICONE THERMAL PAD 325X325X3.0

2

60-11-4511-1671

60-11-4511-1671

Parker Chomerics

CHO-THERM 1671 TO-3

548

3M 5578H-05 9.44

3M 5578H-05 9.44" X 12"

3M

HEAT SINK 8PC PCK

5

TG-A373L-300-300-3.0-0

TG-A373L-300-300-3.0-0

t-Global Technology

THERM PAD 300MMX300MM YELLOW

0

EYG-R0612ZLWF

EYG-R0612ZLWF

Panasonic

THERM PAD 60X120X0.25MM GRAY

13

TG-AL373-13-13-2.0-0

TG-AL373-13-13-2.0-0

t-Global Technology

THERM PAD 13MMX13MM YELLOW

7674

HSP-6

HSP-6

Sensata Technologies – Crydom

THERM PAD 33.78MMX17.02MM W/ADH

130

TG-A6200-25-25-3.0

TG-A6200-25-25-3.0

t-Global Technology

THERM PAD A6200 25X25X3MM

400

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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