| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
JULABO |
PRESTO W85, REFRIG/HEAT CIRC |
1 |
|
 |
Wakefield-Vette |
RECIRC CHILLER 115VAC 1700W |
3 |
|
 |
Advanced Thermal Solutions, Inc. |
HEAT EXCHANGER WITH TWO 12V DC F |
0 |
|
 |
Laird Thermal Systems |
RECIRC CHILLER 2.9LPM 149W 4.7A |
0 |
|
 |
Wakefield-Vette |
COLD PLATE HEAT SINK EXPOSED |
23 |
|
 |
JULABO |
FP55-SL REFIG/HEAT CIRC |
2 |
|
 |
Advanced Thermal Solutions, Inc. |
HEAT EXCHANGER WITH TWO 12V DC F |
4 |
|
 |
Laird Thermal Systems |
RECIRC CHILLR/HEATER 3.3LPM 290W |
1 |
|
 |
Advanced Thermal Solutions, Inc. |
RECIRC CHILLER 15LPM 600W |
1 |
|
 |
Advanced Thermal Solutions, Inc. |
MINI CHANNEL COLD PLATE |
0 |
|
 |
Wakefield-Vette |
COLD PLATE HEAT SINK BURIED |
5 |
|
 |
JULABO |
AWC100 AIR TO WATER COOLER |
5 |
|
 |
Advanced Thermal Solutions, Inc. |
IMMERSION CHILLER 220V 780W 10A |
0 |
|
 |
Wakefield-Vette |
COLD PLATE HEAT SINK 0.041C/W |
0 |
|
 |
JULABO |
PRESTO A30, REFRIG/HEAT CIRC |
1 |
|
 |
Advanced Thermal Solutions, Inc. |
HEAT EXCHANGER WITH FOUR 48V DC |
0 |
|
 |
Laird Thermal Systems |
NRC2400-A1-20-ST1 |
2 |
|
 |
JULABO |
PRESTO W55, REFRIG/HEAT CIRC |
2 |
|
 |
Wakefield-Vette |
COLD PLATE HEAT SINK 0.084C/W |
0 |
|
 |
Advanced Thermal Solutions, Inc. |
MINI CHANNEL COLD PLATE |
12 |
|
Liquid cooling and heating systems are thermal management solutions that use liquid media to transfer heat in electronic, industrial, and mechanical systems. These systems maintain optimal operating temperatures for components by absorbing, transporting, and dissipating heat (cooling) or providing controlled thermal energy (heating). Their importance has grown with increasing power densities in data centers, electric vehicles, and high-performance computing, where traditional air cooling reaches limitations.
| Type | Functional Features | Application Examples |
|---|---|---|
| Direct-to-Chip Liquid Cooling | Targets specific heat sources with cold plates or microchannels | CPU/GPU cooling in servers |
| Immersion Cooling | Submerges components in dielectric coolant | Datacenter server racks |
| Chiller-Based Systems | Uses refrigeration cycles with heat exchangers | Industrial machinery cooling |
| Heating Circulators | Provides precise temperature control through liquid heating | Medical device thermal calibration |
Typical systems include: - Heat exchangers (cold plates, radiators) - Circulation pumps for liquid movement - Fluid reservoirs with level/pressure monitoring - Thermal interface materials (TIMs) - Temperature sensors and control valves - Corrosion-resistant tubing with quick-disconnect fittings Modern designs often integrate smart controllers for dynamic performance adjustment.
| Parameter | Importance | Typical Range |
|---|---|---|
| Cooling Capacity | Determines maximum heat load removal | 1-150 kW |
| Temperature Stability | Critical for sensitive electronics | 0.5 C |
| Flow Rate | Affects thermal response speed | 1-20 L/min |
| Pressure Drop | Impacts pump selection and efficiency | 0.5-5 bar |
| Material Compatibility | Prevents corrosion and leaks | Copper, stainless steel, plastics |
Key industries include: - Data Centers: Liquid-cooled server racks - Automotive: EV battery thermal management - Industrial: Laser cutting machine cooling - Healthcare: MRI scanner temperature control - Renewables: Solar inverter cooling systems
| Manufacturer | Representative Product | Unique Features |
|---|---|---|
| Asetek | Rapid Rack CDU | Modular datacenter cooling |
| CoolIT Systems | DLC Direct-to-Chip | Sealed cold plate technology |
| Danfoss | ORC Turbostack | High-efficiency heat recovery |
| Parker Hannifin | Thermal Loop | Spacecraft thermal control |
Key considerations: - Heat load profile and peak thermal requirements - Space constraints (footprint and height limitations) - Fluid compatibility with existing systems - Maintenance accessibility and service intervals - Energy efficiency (PUE for data centers) - Redundancy requirements for critical systems - Total cost of ownership (TCO) over 5-10 years
Emerging developments include: - Adoption of two-phase immersion cooling in hyperscale data centers - Integration of AI-driven thermal optimization algorithms - Development of nanofluids for enhanced heat transfer - Standardization of liquid cooling interfaces (e.g., OCP standards) - Increased use in EV charging stations (350kW+ fast chargers) - Growth of liquid cooling in 5G base stations and edge computing