Thermal - Adhesives, Epoxies, Greases, Pastes

Part Number	Description / PDF	Quantity
TG-S808-30 t-Global Technology	THERMAL GREASE 30G GREY	23
65-00-CIP35-0045 Parker Chomerics	THERM-A-FORM CIP35 POTTING 45CC	0
TG4040-D-30CC t-Global Technology	SILICONE PUTTY IN 30CC SYRINGE	45
TG4040-2K-50CC t-Global Technology	LIQUID TIM 50CC SYRINGE	95
65-00-GEL45-0010 Parker Chomerics	THERM-A-GAP GEL45 10CC TUBE	181
A16241-02 Laird - Performance Materials	THERMAL GREASE 30CC TGREASE 2500	0
2554689 Henkel / Bergquist	LF3800LVO-00-30CC BERGQUIST LIQU	0
PL-BT-601-50M Wakefield-Vette	ULTIMIFLUX 1W/MK 50ML CARTRIDGE	0
100200F00000G Aavid	THER-O-LINK PASTE TUBE 2OZ	101
S606P-50 t-Global Technology	SILICONE THERMAL GREASE 50G JAR	7
120-80 Wakefield-Vette	SILICONE GREASE 5 LBS CAN	0
65-00-T630-0010 Parker Chomerics	THERM-A-GAP T630 0.7W/M-K 10CC	63
BT-101-50M Wakefield-Vette	NON-SAG 5 MINUTE BONDATHERM EPOX	110
A16241-01 Laird - Performance Materials	THERMAL GREASE 30CC TGREASE 1500	0
S606-1000 t-Global Technology	SILICONE THERMAL GREASE 1KG	0
BT-301-200M-EQZ Wakefield-Vette	TWO DUAL CARTRIDGES (BT-301-200M	7
S606A-ULR-1OZ t-Global Technology	NON-SILICONE THERMAL GREASE	3
NTE303A NTE Electronics, Inc.	SILICON THERMAL COMP 1OZ	1112
S606B-1000 t-Global Technology	SILICONE THERMAL GREASE 1KG	0
TG-PP10-30 t-Global Technology	ONE-PART THERMAL PUTTY 30G POT	54

Thermal - Adhesives, Epoxies, Greases, Pastes

1. Overview

Thermal interface materials (TIMs) are specialized substances designed to enhance heat transfer between mating surfaces. These materials fill microscopic air gaps and reduce thermal resistance in electronic, mechanical, and industrial systems. With increasing power densities in modern devices, effective thermal management has become critical for reliability, performance, and longevity.

2. Main Types & Functional Classification

Type	Functional Characteristics	Application Examples
Thermal Adhesives	Permanently bond surfaces while conducting heat. Available in conductive/dielectric variants.	CPU heatsink bonding, LED module assembly
Epoxy Systems	Two-part compounds with high structural strength and thermal conductivity.	Power module encapsulation, motor controller assembly
Thermal Greases	Non-curing compounds with optimal gap-filling properties.	GPU cooling, automotive sensor mounting
Phase Change Materials	Temperature-activated compounds that optimize interface at operational temperatures.	Server processors, high-frequency amplifiers

3. Structure & Composition

Typical formulations include:

Base Materials: Silicones, epoxies, polyurethanes, or acrylates
Fillers: Aluminum oxide, boron nitride, silver, or graphene for conductivity
Additives: Rheology modifiers, adhesion promoters, and antioxidants

Material microstructure is engineered to balance thermal performance with mechanical compliance.

4. Key Technical Specifications

Parameter	Significance	Typical Range
Thermal Conductivity	Primary measure of heat transfer efficiency	1-8 W/m K
Operating Temperature	Determines application environment suitability	-50 C to 200 C
Viscosity	Affects application method and gap coverage	500-500,000 cP
Dielectric Strength	Electrical insulation capability	5-30 kV/mm
Curing Time/Temperature	Production process compatibility	Room temp-150 C

5. Application Fields

Consumer Electronics: Mobile devices, gaming consoles
Automotive: EV battery packs, power electronics
Industrial: Power supplies, laser systems
LED Lighting: Heat spreader attachment
Aerospace: Avionics thermal management

6. Leading Manufacturers & Products

Manufacturer	Key Products	Specialty
3M	TC-2810 Adhesive	High-conductivity die attach
Dow	SYLGARD 8660	Low-outgassing space applications
Henkel	Berger TIM 880	Phase-change processor pads
Master Bond	EP42HT-2AO	Two-part conductive epoxy

7. Selection Guidelines

Key considerations:

Thermal requirements vs. operating conditions
Material compatibility with substrates
Production process integration (curing, dispensing)
Long-term stability under thermal cycling
Cost-performance tradeoff analysis

Case Study: A server manufacturer reduced CPU operating temperatures by 12 C by switching from standard grease to a phase-change material with optimized melt profile.

Industry Trends

Emerging developments include:

Nano-enhanced composites achieving >10 W/m K
UV-curable formulations for faster processing
Low-VOC water-based systems for environmental compliance
Smart materials with temperature-dependent conductivity
Increased demand from EV battery thermal management systems