| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
t-Global Technology |
SILICONE THERMAL GREASE 30G JAR |
0 |
|
 |
LOCTITE / Henkel |
LOCTITE NSWC 100 THERMAL GREASE |
0 |
|
 |
t-Global Technology |
SILICONE THERMAL GREASE 50G JAR |
0 |
|
 |
t-Global Technology |
NON SILICONE THERMAL GREASE 50G |
0 |
|
 |
Laird - Performance Materials |
TPUTTY 504 1000CC PAIL |
0 |
|
 |
t-Global Technology |
SILICONE THERMAL GREASE 50G JAR |
0 |
|
 |
Laird - Performance Materials |
TPUTTY 504 30CC SYRINGE |
0 |
|
 |
MG Chemicals |
THERMAL GAP FILL LIQUID SILICONE |
0 |
|
 |
LOCTITE / Henkel |
THERMSTRATE 1000 TC 1.75 X 1.25 |
0 |
|
 |
t-Global Technology |
SILICONE THERMAL PUTTY 60CC |
0 |
|
 |
ITW Chemtronics (Chemtronics) |
HEAT SINK GREASE TUBE 5OZ |
0 |
|
|
Laird - Performance Materials |
TPUTTY 504 400CC PAIL |
0 |
|
|
Laird - Performance Materials |
TPUTTY 504 30CC SYRINGE AUTOMATI |
0 |
|
|
Wakefield-Vette |
ADHESIVE COMPOUND |
0 |
|
|
Laird - Performance Materials |
TPUTTY 504 10CC SYRINGE AUTOMATI |
0 |
|
|
Laird - Performance Materials |
TPUTTY 504 3KG PAIL |
0 |
|
|
Laird - Performance Materials |
TPUTTY 504 100CC CARTRIDGE |
0 |
|
|
Laird - Performance Materials |
TPUTTY 504 305CC CARTRIDGE |
0 |
|
|
Laird - Performance Materials |
TPUTTY 504 55CC SYRINGE MANUAL |
0 |
|
|
3M |
THERMALLY CONDUCTIVE GREASE 10 |
0 |
|
Thermal interface materials (TIMs) are specialized substances designed to enhance heat transfer between mating surfaces. These materials fill microscopic air gaps and reduce thermal resistance in electronic, mechanical, and industrial systems. With increasing power densities in modern devices, effective thermal management has become critical for reliability, performance, and longevity.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Thermal Adhesives | Permanently bond surfaces while conducting heat. Available in conductive/dielectric variants. | CPU heatsink bonding, LED module assembly |
| Epoxy Systems | Two-part compounds with high structural strength and thermal conductivity. | Power module encapsulation, motor controller assembly |
| Thermal Greases | Non-curing compounds with optimal gap-filling properties. | GPU cooling, automotive sensor mounting |
| Phase Change Materials | Temperature-activated compounds that optimize interface at operational temperatures. | Server processors, high-frequency amplifiers |
Typical formulations include:
Material microstructure is engineered to balance thermal performance with mechanical compliance.
| Parameter | Significance | Typical Range |
|---|---|---|
| Thermal Conductivity | Primary measure of heat transfer efficiency | 1-8 W/m K |
| Operating Temperature | Determines application environment suitability | -50 C to 200 C |
| Viscosity | Affects application method and gap coverage | 500-500,000 cP |
| Dielectric Strength | Electrical insulation capability | 5-30 kV/mm |
| Curing Time/Temperature | Production process compatibility | Room temp-150 C |
| Manufacturer | Key Products | Specialty |
|---|---|---|
| 3M | TC-2810 Adhesive | High-conductivity die attach |
| Dow | SYLGARD 8660 | Low-outgassing space applications |
| Henkel | Berger TIM 880 | Phase-change processor pads |
| Master Bond | EP42HT-2AO | Two-part conductive epoxy |
Key considerations:
Case Study: A server manufacturer reduced CPU operating temperatures by 12 C by switching from standard grease to a phase-change material with optimized melt profile.
Emerging developments include: