Thermal - Adhesives, Epoxies, Greases, Pastes

Part Number	Description / PDF	Quantity
A16000-00 Laird - Performance Materials	TPCM 580SP 1KG CAN 1QUART	0
65-00-GEL75-0300 Parker Chomerics	THERM-A-GAP GEL 75 7.5 W/M-K DIS	0
A15693-01 Laird - Performance Materials	TGREASE 880S 1.0 KG	0
153-G-NC Wakefield-Vette	THERMAL EPOXY	0
A16001-00 Laird - Performance Materials	TPCM 780SP 1KG CAN 1QUART	0
A16850-01 Laird - Performance Materials	TGREASE 300X 1KG CAN 1QUART	0
103700F00000G Aavid	1.5 OZ. SYRINGE GREASE NON-SILIC	99
A15028-02 Laird - Performance Materials	THERMAL GREASE 1KG TGREASE 880	0
A10548-5 Laird - Performance Materials	TPUTTY 502 100CC	0
1188035 LOCTITE / Henkel	CATALYST 23LV CLR 1LB 0.454KG	0
1188099 LOCTITE / Henkel	STYCAST 2762FT BLK 3# INDIVIDUAL	27
A16412-04 Laird - Performance Materials	TPUTTY 506 600CC CARTRIDGE	0
100000F00000G Aavid	THERMAL PASTE	0
65-00-GEL37-0010 Parker Chomerics	THERM-A-GAP GEL 37 3.7 W/M-K DIS	0
122-30CC Wakefield-Vette	SILICONE GREASE 30CC SYRINGE	0
TIC4000-00-00-25CC Henkel / Bergquist	TIC 4000 25CC SYRINGE	0
A16858-10 Laird - Performance Materials	TFLEX CR200 10 MIL 200CC CARTRID	0
A14855-01 Laird - Performance Materials	THERMAL GREASE 7KG TGREASE 1500	0
A16872-01 Laird - Performance Materials	TPUTTY 403 20 KG 5 GAL PAIL	0
104100F00000G Aavid	16.0 OZ JAR GREASE NON-SILICONE	24

Thermal - Adhesives, Epoxies, Greases, Pastes

1. Overview

Thermal interface materials (TIMs) are specialized substances designed to enhance heat transfer between mating surfaces. These materials fill microscopic air gaps and reduce thermal resistance in electronic, mechanical, and industrial systems. With increasing power densities in modern devices, effective thermal management has become critical for reliability, performance, and longevity.

2. Main Types & Functional Classification

Type	Functional Characteristics	Application Examples
Thermal Adhesives	Permanently bond surfaces while conducting heat. Available in conductive/dielectric variants.	CPU heatsink bonding, LED module assembly
Epoxy Systems	Two-part compounds with high structural strength and thermal conductivity.	Power module encapsulation, motor controller assembly
Thermal Greases	Non-curing compounds with optimal gap-filling properties.	GPU cooling, automotive sensor mounting
Phase Change Materials	Temperature-activated compounds that optimize interface at operational temperatures.	Server processors, high-frequency amplifiers

3. Structure & Composition

Typical formulations include:

Base Materials: Silicones, epoxies, polyurethanes, or acrylates
Fillers: Aluminum oxide, boron nitride, silver, or graphene for conductivity
Additives: Rheology modifiers, adhesion promoters, and antioxidants

Material microstructure is engineered to balance thermal performance with mechanical compliance.

4. Key Technical Specifications

Parameter	Significance	Typical Range
Thermal Conductivity	Primary measure of heat transfer efficiency	1-8 W/m K
Operating Temperature	Determines application environment suitability	-50 C to 200 C
Viscosity	Affects application method and gap coverage	500-500,000 cP
Dielectric Strength	Electrical insulation capability	5-30 kV/mm
Curing Time/Temperature	Production process compatibility	Room temp-150 C

5. Application Fields

Consumer Electronics: Mobile devices, gaming consoles
Automotive: EV battery packs, power electronics
Industrial: Power supplies, laser systems
LED Lighting: Heat spreader attachment
Aerospace: Avionics thermal management

6. Leading Manufacturers & Products

Manufacturer	Key Products	Specialty
3M	TC-2810 Adhesive	High-conductivity die attach
Dow	SYLGARD 8660	Low-outgassing space applications
Henkel	Berger TIM 880	Phase-change processor pads
Master Bond	EP42HT-2AO	Two-part conductive epoxy

7. Selection Guidelines

Key considerations:

Thermal requirements vs. operating conditions
Material compatibility with substrates
Production process integration (curing, dispensing)
Long-term stability under thermal cycling
Cost-performance tradeoff analysis

Case Study: A server manufacturer reduced CPU operating temperatures by 12 C by switching from standard grease to a phase-change material with optimized melt profile.

Industry Trends

Emerging developments include:

Nano-enhanced composites achieving >10 W/m K
UV-curable formulations for faster processing
Low-VOC water-based systems for environmental compliance
Smart materials with temperature-dependent conductivity
Increased demand from EV battery thermal management systems