| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
iBASE Technology |
ITX, AMD GX-424CC APU(2.4GHZ) SO |
1 |
|
 |
iBASE Technology |
RISC 3.5-INCH SBC W/ INDUSTRIAL- |
1 |
|
 |
iBASE Technology |
3.5" INTEL CORE I7-6600U (2.6GHZ |
1 |
|
 |
iBASE Technology |
(DS), ULTRA COMPACT FANLESS EMBE |
1 |
|
 |
iBASE Technology |
ITX, INTEL XEON E-2176M(2.4GHZ ~ |
1 |
|
 |
iBASE Technology |
IOPS, AMD GX-224IJ 2.4GHZ APU, |
1 |
|
 |
iBASE Technology |
FS, LGA1155 SOCKET FOR INTEL 2N |
1 |
|
 |
iBASE Technology |
COM EXPRESS (TYPE 6), INTEL CORE |
1 |
|
 |
iBASE Technology |
(AMI) ALUMINUM CHASSIS WITH MB21 |
1 |
|
 |
iBASE Technology |
NXP CORTEX-A53 I.MX 8M DUAL INDU |
1 |
|
 |
iBASE Technology |
(AMI) ALUMINUM SYSTEM WITH MI970 |
1 |
|
 |
iBASE Technology |
NXP I.MX6 CORTEX A9 DUAL-LITE 1G |
1 |
|
 |
iBASE Technology |
FS, LGA1155 SOCKET FOR INTEL 3RD |
1 |
|
 |
iBASE Technology |
QSEVEN CPU MODULE, INTEL X7-E39 |
1 |
|
 |
iBASE Technology |
CUSTOM, INTEL ATOM C2758 WITH QU |
1 |
|
 |
iBASE Technology |
ITX, LGA1150 CORE I7/I5/I3, Q87 |
1 |
|
 |
iBASE Technology |
3.5", AMD EMBEDDED G-SERIES DC S |
1 |
|
 |
iBASE Technology |
COM EXPRESS (TYPE 6), INTEL CORE |
1 |
|
 |
iBASE Technology |
ITX, INTEL 3RD GEN. MOBILE CORE |
1 |
|
 |
iBASE Technology |
ITX, INTEL XEON E3-1278L V4 (2GH |
1 |
|
Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| SBC (e.g., Raspberry Pi) | Complete system with CPU, RAM, storage, and I/O interfaces | Smart home devices, educational tools |
| COM (e.g., COM Express) | Modular design with processor, memory, and basic I/O; requires carrier board | Medical imaging systems, industrial controllers |
| Industrial SBC | Ruggedized components for harsh environments | Factory automation, outdoor kiosks |
A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.
| Parameter | Description | Importance |
|---|---|---|
| CPU Performance | Measured in DMIPS or GHz | Determines processing capability |
| Thermal Design Power (TDP) | Power consumption in watts | Impacts cooling requirements |
| Interface Types | USB 3.0, PCIe, CAN, etc. | Dictates peripheral compatibility |
| Operating Temperature | -40 C to +85 C range | Defines environmental tolerance |
| Manufacturer | Product Series | Key Features |
|---|---|---|
| Raspberry Pi Foundation | Raspberry Pi 4 Model B | Quad-core Cortex-A72, 4K HDMI |
| Intel | COM Express modules | 11th Gen Core processors, PCIe 4.0 |
| NVIDIA | JETSON AGX Xavier | AI accelerator, 32 TOPS performance |
| Advantech | AIMB-236 SBC | Intel Atom x6425E, -20 C to 70 C operation |
Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.
Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.