Single Board Computers (SBCs), Computer On Module (COM)

Part Number	Description / PDF	Quantity
VL-EPMP-34S VersaLogic Corporation	PCI-104 DUAL CORE 2.27GHZ	0
VL-EPME-30EBPA VersaLogic Corporation	BENGAL 2-CORE CPU 1.46GHZ ET	0
VL-EPM-43ECP-16 VersaLogic Corporation	LIGER 2-CORE CPU, KABY LAKE, ET,	1
VL-EPME-30EBP VersaLogic Corporation	BENGAL BOARD DUAL CORE 1.46GHZ	35
VL-EPU-3312-EDP VersaLogic Corporation	RAVEN BOARD QUAD 1.91GHZ	33
VL-ESU-5070ECP-32X VersaLogic Corporation	EMBED SVR. C3958 2.0 GHZ, 32GB E	7
VL-EPIC-17EA VersaLogic Corporation	SBC VORTEX 800 MHZ 256 MB	117
VL-EBXE-41SJF VersaLogic Corporation	SBC COPPERHEAD 4 CORE I7 2.3GHZ	0
VL-EPME-42SCP-16 VersaLogic Corporation	SINGLE BOARD COMPUTER	0
VL-EPM-43ECP-08 VersaLogic Corporation	LIGER 2-CORE CPU, KABY LAKE, ET,	0
VL-EPM-19EBK VersaLogic Corporation	SINGLE BOARD COMPUTER	1
VL-EPIC-17EB VersaLogic Corporation	SBC VORTEX 800 MHZ 512 MB	1
VL-EPU-4562-ECP-32 VersaLogic Corporation	EMBEDDED PROCESSING UNIT	32
VL-EPC-2701-EAK-005 VersaLogic Corporation	ZEBRA SINGLE-CORE I.MX6 SOLO CPU	2
VL-EPU-3311-EBP VersaLogic Corporation	SBC ATOM BAY TRAIL DUAL 1.75GZ	38
VL-EPME-42SAP-04 VersaLogic Corporation	SINGLE BOARD COMPUTER	0
VL-EPM-43ECP-04 VersaLogic Corporation	LIGER 2-CORE CPU, KABY LAKE, ET,	1
VL-EPM-16S VersaLogic Corporation	SBC VORTEX 800 MHZ 128MB	0
VL-EBX-18EBK VersaLogic Corporation	VORTEX86DX2 CPU 800MHZ ET 1GB	21
VL-EBX-18SCK VersaLogic Corporation	VORTEX86DX2 CPU 1GHZ 2GB	0

Single Board Computers (SBCs), Computer On Module (COM)

1. Overview

Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
SBC (e.g., Raspberry Pi)	Complete system with CPU, RAM, storage, and I/O interfaces	Smart home devices, educational tools
COM (e.g., COM Express)	Modular design with processor, memory, and basic I/O; requires carrier board	Medical imaging systems, industrial controllers
Industrial SBC	Ruggedized components for harsh environments	Factory automation, outdoor kiosks

3. Structure and Components

A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.

4. Key Technical Specifications

Parameter	Description	Importance
CPU Performance	Measured in DMIPS or GHz	Determines processing capability
Thermal Design Power (TDP)	Power consumption in watts	Impacts cooling requirements
Interface Types	USB 3.0, PCIe, CAN, etc.	Dictates peripheral compatibility
Operating Temperature	-40 C to +85 C range	Defines environmental tolerance

5. Application Areas

Industrial: CNC machines, PLC controllers
Healthcare: Patient monitoring systems, diagnostic equipment
Transportation: In-vehicle infotainment, ADAS
Smart Cities: Surveillance cameras, environmental sensors

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Raspberry Pi Foundation	Raspberry Pi 4 Model B	Quad-core Cortex-A72, 4K HDMI
Intel	COM Express modules	11th Gen Core processors, PCIe 4.0
NVIDIA	JETSON AGX Xavier	AI accelerator, 32 TOPS performance
Advantech	AIMB-236 SBC	Intel Atom x6425E, -20 C to 70 C operation

7. Selection Guidelines

Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.

8. Industry Trends

Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.