Single Board Computers (SBCs), Computer On Module (COM)

Image	Part Number	Description / PDF	Quantity	Rfq
	TEK3IMX6G05R05E04GL124 TechNexion	TEK3 FANLESS BOX PC NXP I.MX6UL	0
	TEK3IMX6G05R05E04LPOEXS20 TechNexion	TEK3 FANLESS BOX PC NXP I.MX6UL	0
	EDM1IMX6PQPR20E04BBTE TechNexion	EDM COMPACT TYPE 1 NXP I.MX6 QUA	0
	PICOIMX6G205R512N512TE TechNexion	PICO SOM NXP I.MX6 ULTRALITE 528	0
	EDM1IMX6PQR20E04 TechNexion	MODULE EDM COMPACT TYPE 1	0
	EDM2CFIMX6S10R512NI4GL2C TechNexion	MOD EDM COMPACT TYPE2 I.MX6 SGL	0
	EDM1IMX6PUR10E04BWTE TechNexion	MODULE EDM COMPACT TYPE 1	0
	EDM1CFIMX6S10R512NI4GL2CTE TechNexion	MOD EDM COMPACT TYPE1 I.MX6 SGL	0
	PICOIMX6S10R512SDBW TechNexion	KIT STARTER FOR I.MX6	0
	TEK3IMX6G05R05E04L124 TechNexion	TEK3 FANLESS BOX PC NXP I.MX6UL	0
	PICOIMX6G205R128N128 TechNexion	PICO SOM NXP I.MX6 ULTRALITE 528	0
	PICOIMX6G205R512N512TI TechNexion	PICO SOM NXP I.MX6 ULTRALITE 528	0
	PICOIMX6S10R512NI4GBWTE TechNexion	PICO SOM NXP I.MX6 SOLO 1GHZ + 5	0
	PICOIMX6G205R256N256BW TechNexion	PICO SOM NXP I.MX6 ULTRALITE 528	0
	PICOIMX6G205R512E04BBTE TechNexion	PICO SOM NXP I.MX6 ULTRALITE 528	0
	PICOIMX6G205R512E04TE TechNexion	PICO SOM NXP I.MX6 ULTRALITE 528	0
	PICOIMX6Q10R1GBNI4G TechNexion	PICO SOM NXP I.MX6 QUAD 1GHZ + 1	0
	TEK3IMX6UR10E04L130XG20 TechNexion	TEK3 FANLESS BOX PC NXP I.MX6 DU	0
	PICOIMX7DR05E04 TechNexion	PICO SOM NXP I.MX7 DUAL 1GHZ + 5	0
	EDM1CFIMX6QC10R2GBNI4GLS2C TechNexion	EDM COMPACT TYPE 1 NXP I.MX6 QUA	0

Single Board Computers (SBCs), Computer On Module (COM)

1. Overview

Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
SBC (e.g., Raspberry Pi)	Complete system with CPU, RAM, storage, and I/O interfaces	Smart home devices, educational tools
COM (e.g., COM Express)	Modular design with processor, memory, and basic I/O; requires carrier board	Medical imaging systems, industrial controllers
Industrial SBC	Ruggedized components for harsh environments	Factory automation, outdoor kiosks

3. Structure and Components

A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.

4. Key Technical Specifications

Parameter	Description	Importance
CPU Performance	Measured in DMIPS or GHz	Determines processing capability
Thermal Design Power (TDP)	Power consumption in watts	Impacts cooling requirements
Interface Types	USB 3.0, PCIe, CAN, etc.	Dictates peripheral compatibility
Operating Temperature	-40 C to +85 C range	Defines environmental tolerance

5. Application Areas

Industrial: CNC machines, PLC controllers
Healthcare: Patient monitoring systems, diagnostic equipment
Transportation: In-vehicle infotainment, ADAS
Smart Cities: Surveillance cameras, environmental sensors

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Raspberry Pi Foundation	Raspberry Pi 4 Model B	Quad-core Cortex-A72, 4K HDMI
Intel	COM Express modules	11th Gen Core processors, PCIe 4.0
NVIDIA	JETSON AGX Xavier	AI accelerator, 32 TOPS performance
Advantech	AIMB-236 SBC	Intel Atom x6425E, -20 C to 70 C operation

7. Selection Guidelines

Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.

8. Industry Trends

Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.