| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Advantech |
INTEL SKYLAKE-S, BAREBONE W/ PCI |
0 |
|
|
Advantech |
32" UTC WITH BAYTRAIL J1900/ 4G |
0 |
|
|
Advantech |
ITA-5730 I3-3217UE+HM76 4G DDR3 |
0 |
|
|
Advantech |
COMPACT FANLESS EMBEDDED IPC |
0 |
|
|
Advantech |
QUAD CORE / 1GB DDR SYSTEM |
0 |
|
|
Advantech |
INTEL ATOM D525 W/PLATINUM -40 8 |
0 |
|
|
Freescale Semiconductor, Inc. (NXP Semiconductors) |
QORIQ, 64 BIT POWER ARCH SOC, 2 |
0 |
|
|
Advantech |
DPX-E130 WITH AMD T56N 1.65GHZ 1 |
0 |
|
|
TechNexion |
MOD EDM COMPACT TYPE2 I.MX6 DUAL |
0 |
|
|
Advantech |
MIC-7500 FANLESS SYSTEM |
0 |
|
|
TechNexion |
PICO SOM NXP I.MX6 ULTRALITE 528 |
0 |
|
|
Advantech |
INTEL I5-4402E 1.6GHZ |
0 |
|
|
PHAD 1.1 CMOS6SF 5MT 32CCGA937 |
0 |
|
|
|
VAN ALLEN 4.1 CM6SF 5MT |
0 |
|
|
|
Advantech |
INTEL QM67 COM EXPRESS I7-2655LE |
0 |
|
|
Advantech |
DPX-E120 AMD G-SERIES GAMING SYS |
0 |
|
|
Advantech |
INTEL I3-4100E 2.4GHZ |
0 |
|
|
Advantech |
SIGNAGE BOX WITH CELERON B810E |
0 |
|
|
TechNexion |
PICO SOM NXP I.MX6 ULTRALITE 528 |
0 |
|
|
Advantech |
IN-VEHICLE FULL HD NVR |
0 |
|
Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| SBC (e.g., Raspberry Pi) | Complete system with CPU, RAM, storage, and I/O interfaces | Smart home devices, educational tools |
| COM (e.g., COM Express) | Modular design with processor, memory, and basic I/O; requires carrier board | Medical imaging systems, industrial controllers |
| Industrial SBC | Ruggedized components for harsh environments | Factory automation, outdoor kiosks |
A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.
| Parameter | Description | Importance |
|---|---|---|
| CPU Performance | Measured in DMIPS or GHz | Determines processing capability |
| Thermal Design Power (TDP) | Power consumption in watts | Impacts cooling requirements |
| Interface Types | USB 3.0, PCIe, CAN, etc. | Dictates peripheral compatibility |
| Operating Temperature | -40 C to +85 C range | Defines environmental tolerance |
| Manufacturer | Product Series | Key Features |
|---|---|---|
| Raspberry Pi Foundation | Raspberry Pi 4 Model B | Quad-core Cortex-A72, 4K HDMI |
| Intel | COM Express modules | 11th Gen Core processors, PCIe 4.0 |
| NVIDIA | JETSON AGX Xavier | AI accelerator, 32 TOPS performance |
| Advantech | AIMB-236 SBC | Intel Atom x6425E, -20 C to 70 C operation |
Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.
Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.