Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
APT32M80J

APT32M80J

Roving Networks / Microchip Technology

MOSFET N-CH 800V 33A ISOTOP

0

APT34N80LC3G

APT34N80LC3G

Roving Networks / Microchip Technology

MOSFET N-CH 800V 34A TO264

0

APT14M120S

APT14M120S

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 14A D3PAK

150

APTM10UM01FAG

APTM10UM01FAG

Roving Networks / Microchip Technology

MOSFET N-CH 100V 860A SP6

0

APT5024SLLG/TR

APT5024SLLG/TR

Roving Networks / Microchip Technology

MOSFET N-CH 500V 22A D3PAK

0

VN2224N3-G

VN2224N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 240V 540MA TO92-3

0

APT60M60JLL

APT60M60JLL

Roving Networks / Microchip Technology

MOSFET N-CH 600V 70A ISOTOP

0

VP2206N3-G-P003

VP2206N3-G-P003

Roving Networks / Microchip Technology

MOSFET P-CH 60V 640MA TO92-3

0

APT22F120L

APT22F120L

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 23A TO264

5

TN0104N3-G-P003

TN0104N3-G-P003

Roving Networks / Microchip Technology

MOSFET N-CH 40V 450MA TO92-3

0

APT5010JLLU3

APT5010JLLU3

Roving Networks / Microchip Technology

MOSFET N-CH 500V 41A SOT227

0

VN0300L-G-P002

VN0300L-G-P002

Roving Networks / Microchip Technology

MOSFET N-CH 30V 640MA TO92-3

0

APT34M60S/TR

APT34M60S/TR

Roving Networks / Microchip Technology

MOSFET N-CH 600V 36A D3PAK

0

TP2510N8-G

TP2510N8-G

Roving Networks / Microchip Technology

MOSFET P-CH 100V 480MA TO243AA

16347

APT50M85JVR

APT50M85JVR

Roving Networks / Microchip Technology

MOSFET N-CH 500V 50A ISOTOP

0

APT12M80B

APT12M80B

Roving Networks / Microchip Technology

MOSFET N-CH 800V 13A TO247

0

APT18F60B

APT18F60B

Roving Networks / Microchip Technology

MOSFET N-CH 600V 19A TO247

0

APT30M30JLL

APT30M30JLL

Roving Networks / Microchip Technology

MOSFET N-CH 300V 88A ISOTOP

0

APT14F100S

APT14F100S

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 14A D3PAK

0

VN0106N3-G

VN0106N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 60V 350MA TO92-3

1300

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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