Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
APT1001RBVFRG

APT1001RBVFRG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 11A TO247

0

APT20M120JCU3

APT20M120JCU3

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 20A SOT227

0

APT50M75B2FLLG

APT50M75B2FLLG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 57A T-MAX

0

APT30F60J

APT30F60J

Roving Networks / Microchip Technology

MOSFET N-CH 600V 31A ISOTOP

10

APT30M60J

APT30M60J

Roving Networks / Microchip Technology

MOSFET N-CH 600V 31A ISOTOP

0

APT50M65B2FLLG

APT50M65B2FLLG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 67A T-MAX

0

APT12057LFLLG

APT12057LFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 22A TO264

0

APT20M18B2VRG

APT20M18B2VRG

Roving Networks / Microchip Technology

MOSFET N-CH 200V 100A T-MAX

0

TN5335K1-G

TN5335K1-G

Roving Networks / Microchip Technology

MOSFET N-CH 350V 110MA SOT23

5651

VP2110K1-G

VP2110K1-G

Roving Networks / Microchip Technology

MOSFET P-CH 100V 120MA TO236AB

4110

VN0606L-G

VN0606L-G

Roving Networks / Microchip Technology

MOSFET N-CH 60V 330MA TO92-3

845

VN4012L-G

VN4012L-G

Roving Networks / Microchip Technology

MOSFET N-CH 400V 160MA TO92-3

0

APT7M120S

APT7M120S

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 8A D3PAK

0

DN2450K4-G

DN2450K4-G

Roving Networks / Microchip Technology

MOSFET N-CH 500V 350MA TO252

1285

APT66M60B2

APT66M60B2

Roving Networks / Microchip Technology

MOSFET N-CH 600V 70A T-MAX

0

APT20M18LVRG

APT20M18LVRG

Roving Networks / Microchip Technology

MOSFET N-CH 200V 100A TO264

0

TN0606N3-G

TN0606N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 60V 500MA TO92-3

762

TN2130K1-G

TN2130K1-G

Roving Networks / Microchip Technology

MOSFET N-CH 300V 85MA TO236AB

3397

APT23F60B

APT23F60B

Roving Networks / Microchip Technology

MOSFET N-CH 600V 24A TO247

0

MSC090SMA070S

MSC090SMA070S

Roving Networks / Microchip Technology

SICFET N-CH 700V D3PAK

81

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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