Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
APT66F60L

APT66F60L

Roving Networks / Microchip Technology

MOSFET N-CH 600V 70A TO264

0

APT31M100B2

APT31M100B2

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 32A T-MAX

0

APT51M50J

APT51M50J

Roving Networks / Microchip Technology

MOSFET N-CH 500V 51A ISOTOP

75

APT8020JLL

APT8020JLL

Roving Networks / Microchip Technology

MOSFET N-CH 800V 33A ISOTOP

20

APT22F80B

APT22F80B

Roving Networks / Microchip Technology

MOSFET N-CH 800V 23A TO247

0

APT53F80J

APT53F80J

Roving Networks / Microchip Technology

MOSFET N-CH 800V 57A ISOTOP

142

APL502J

APL502J

Roving Networks / Microchip Technology

MOSFET N-CH 500V 52A ISOTOP

134

APT28M120B2

APT28M120B2

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 29A T-MAX

207

APT10078BFLLG

APT10078BFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 14A TO247

0

APT31M100L

APT31M100L

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 32A TO264

14

APT20M34BLLG

APT20M34BLLG

Roving Networks / Microchip Technology

MOSFET N-CH 200V 74A TO247

0

MSC70SM120JCU3

MSC70SM120JCU3

Roving Networks / Microchip Technology

TRANS SJT N-CH 1.2KV 89A SOT227

37

TN2425N8-G

TN2425N8-G

Roving Networks / Microchip Technology

MOSFET N-CH 25V 480MA SOT89-3

1740

APT5016BFLLG

APT5016BFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 30A TO247

0

VP0106N3-G

VP0106N3-G

Roving Networks / Microchip Technology

MOSFET P-CH 60V 250MA TO92-3

463

APT8043BFLLG

APT8043BFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 800V 20A TO247

0

MSC090SMA070B

MSC090SMA070B

Roving Networks / Microchip Technology

SICFET N-CH 700V TO247-3

34

APT20M45BVFRG

APT20M45BVFRG

Roving Networks / Microchip Technology

MOSFET N-CH 200V 56A TO247

0

APT5010JLL

APT5010JLL

Roving Networks / Microchip Technology

MOSFET N-CH 500V 41A ISOTOP

0

APTM100UM45DAG

APTM100UM45DAG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 215A SP6

85

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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