Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
APT6025BLLG

APT6025BLLG

Roving Networks / Microchip Technology

MOSFET N-CH 600V 24A TO247

0

DN2470K4-G

DN2470K4-G

Roving Networks / Microchip Technology

MOSFET N-CH 700V 170MA TO252

22420

APT37M100B2

APT37M100B2

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 37A T-MAX

30

APT39M60J

APT39M60J

Roving Networks / Microchip Technology

MOSFET N-CH 600V 42A ISOTOP

0

APT20M22LVRG

APT20M22LVRG

Roving Networks / Microchip Technology

MOSFET N-CH 200V 100A TO264

1

MSC060SMA070B

MSC060SMA070B

Roving Networks / Microchip Technology

SICFET N-CH 700V 39A TO247-3

111

MSC040SMA120J

MSC040SMA120J

Roving Networks / Microchip Technology

SICFET N-CH 1200V 53A SOT227

27

APT40M70LVRG

APT40M70LVRG

Roving Networks / Microchip Technology

MOSFET N-CH 400V 57A TO264

90

APT50M85JVFR

APT50M85JVFR

Roving Networks / Microchip Technology

MOSFET N-CH 500V 50A ISOTOP

0

APT10090BFLLG

APT10090BFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 12A TO247

0

APT38F80L

APT38F80L

Roving Networks / Microchip Technology

MOSFET N-CH 800V 41A TO264

0

2N7002-G

2N7002-G

Roving Networks / Microchip Technology

MOSFET N-CH 60V 115MA SOT23

840

APT6013JFLL

APT6013JFLL

Roving Networks / Microchip Technology

MOSFET N-CH 600V 39A ISOTOP

0

APT50M75LLLG

APT50M75LLLG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 57A TO264

0

APT10050LVRG

APT10050LVRG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 21A TO264

0

TP2522N8-G

TP2522N8-G

Roving Networks / Microchip Technology

MOSFET P-CH 220V 260MA TO243AA

0

APT44F80L

APT44F80L

Roving Networks / Microchip Technology

MOSFET N-CH 800V 47A TO264

0

APT1201R4BLLG

APT1201R4BLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 9A TO247

150

DN2530N8-G

DN2530N8-G

Roving Networks / Microchip Technology

MOSFET N-CH 300V 200MA TO243AA

0

APT18M100B

APT18M100B

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 18A TO247

15

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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