Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
BSC240N12NS3G

BSC240N12NS3G

IR (Infineon Technologies)

N-CHANNEL POWER MOSFET

9047

BSO301SPNTMA1

BSO301SPNTMA1

IR (Infineon Technologies)

MOSFET P-CH 30V 12.6A DSO-8

25788

IPD50R280CEATMA1

IPD50R280CEATMA1

IR (Infineon Technologies)

500V COOLMOS N-CHANNEL

0

BTS112AE3045ANTMA1

BTS112AE3045ANTMA1

IR (Infineon Technologies)

N-CHANNEL POWER MOSFET

1500

IRFP4332PBF

IRFP4332PBF

IR (Infineon Technologies)

MOSFET N-CH 250V 57A TO247AC

714

IPI65R099C6

IPI65R099C6

IR (Infineon Technologies)

N-CHANNEL POWER MOSFET

0

SPP02N60C3

SPP02N60C3

IR (Infineon Technologies)

N-CHANNEL POWER MOSFET

75034

IPB60R360P7ATMA1

IPB60R360P7ATMA1

IR (Infineon Technologies)

IPB60R360 - 600V, 0.36OHM, N-CHA

1364

IRF9540NSTRRPBF

IRF9540NSTRRPBF

IR (Infineon Technologies)

MOSFET P-CH 100V 23A D2PAK

0

IRFH8316TRPBF

IRFH8316TRPBF

IR (Infineon Technologies)

MOSFET N-CH 30V 27A/50A TDSON0

4000

IRF7406PBF

IRF7406PBF

IR (Infineon Technologies)

MOSFET P-CH 30V 5.8A 8SO

0

IPI80N04S4L04AKSA1

IPI80N04S4L04AKSA1

IR (Infineon Technologies)

MOSFET N-CH 40V 80A TO262-3

26000

AUIRLU024Z

AUIRLU024Z

IR (Infineon Technologies)

MOSFET N-CH 55V 16A I-PAK

13425

BSL302SNL6327

BSL302SNL6327

IR (Infineon Technologies)

SMALL SIGNAL N-CHANNEL MOSFET

0

IRFH8324TRPBF

IRFH8324TRPBF

IR (Infineon Technologies)

MOSFET N-CH 30V 23A/90A PQFN

0

IPI126N10N3G

IPI126N10N3G

IR (Infineon Technologies)

N-CHANNEL POWER MOSFET

0

IPA80R310CE

IPA80R310CE

IR (Infineon Technologies)

IPA80R310 - 800V COOLMOS N-CHANN

0

IPD050N03LGBTMA1

IPD050N03LGBTMA1

IR (Infineon Technologies)

MOSFET N-CH 30V 50A TO252-31

0

IPA60R280CFD7XKSA1

IPA60R280CFD7XKSA1

IR (Infineon Technologies)

MOSFET N-CH 650V 6A TO220

160

IRLML6344TRPBF

IRLML6344TRPBF

IR (Infineon Technologies)

MOSFET N-CH 30V 5A MICRO3/SOT23

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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