Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
AUIRFR540Z

AUIRFR540Z

IR (Infineon Technologies)

MOSFET N-CH 100V 35A DPAK

1351

IPZA60R024P7XKSA1

IPZA60R024P7XKSA1

IR (Infineon Technologies)

MOSFET N-CH 600V 101A TO247-4-3

0

IRFS31N20DTRLP

IRFS31N20DTRLP

IR (Infineon Technologies)

HEXFET N-CHANNEL POWER MOSFET

0

IRF9333TRPBF

IRF9333TRPBF

IR (Infineon Technologies)

MOSFET P-CH 30V 9.2A 8SO

0

IRFR220NTRLPBF

IRFR220NTRLPBF

IR (Infineon Technologies)

MOSFET N-CH 200V 5A DPAK

1088

IRF8734PBF

IRF8734PBF

IR (Infineon Technologies)

HEXFET POWER MOSFET

3192

IPB039N10N3GE8187ATMA1

IPB039N10N3GE8187ATMA1

IR (Infineon Technologies)

MOSFET N-CH 100V 160A TO263-7

0

IRF7606TR

IRF7606TR

IR (Infineon Technologies)

MOSFET P-CH 30V 3.6A MICRO8

2183

IRFU7740PBF

IRFU7740PBF

IR (Infineon Technologies)

MOSFET N-CH 75V 87A IPAK

0

IPD30N06S223ATMA1

IPD30N06S223ATMA1

IR (Infineon Technologies)

MOSFET N-CH 55V 30A TO252-3

45000

IPZ40N04S55R4ATMA1

IPZ40N04S55R4ATMA1

IR (Infineon Technologies)

MOSFET N-CH 40V 40A 8TSDSON

14851

IPP90R340C3XKSA2

IPP90R340C3XKSA2

IR (Infineon Technologies)

MOSFET N-CH 900V 15A TO220-3

0

BSS214NWH6327XTSA1

BSS214NWH6327XTSA1

IR (Infineon Technologies)

MOSFET N-CH 20V 1.5A SOT323-3

49263

IRFB7746PBF

IRFB7746PBF

IR (Infineon Technologies)

MOSFET N-CH 75V 59A TO220AB

900

IPD12CN10NG

IPD12CN10NG

IR (Infineon Technologies)

OPTLMOS N-CHANNEL POWER MOSFET

7585

SPW11N60C3

SPW11N60C3

IR (Infineon Technologies)

N-CHANNEL POWER MOSFET

8869

IPD60R400CEAUMA1

IPD60R400CEAUMA1

IR (Infineon Technologies)

MOSFET N-CH 600V 14.7A TO252

3040

IRF6215STRRPBF

IRF6215STRRPBF

IR (Infineon Technologies)

MOSFET P-CH 150V 13A D2PAK

0

IRFB4710PBF

IRFB4710PBF

IR (Infineon Technologies)

MOSFET N-CH 100V 75A TO220AB

980

IPS80R1K4P7

IPS80R1K4P7

IR (Infineon Technologies)

IPS80R1K4 - 800V COOLMOS N-CHANN

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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