Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXTQ96N15P

IXTQ96N15P

Wickmann / Littelfuse

MOSFET N-CH 150V 96A TO3P

0

IXFQ50N60X

IXFQ50N60X

Wickmann / Littelfuse

MOSFET N-CH 600V 50A TO3P

750

IXFA10N60P

IXFA10N60P

Wickmann / Littelfuse

MOSFET N-CH 600V 10A TO263

45650

IXFX230N20T

IXFX230N20T

Wickmann / Littelfuse

MOSFET N-CH 200V 230A PLUS247-3

1590

IXFX80N50Q3

IXFX80N50Q3

Wickmann / Littelfuse

MOSFET N-CH 500V 80A PLUS247-3

0

IXTP90N055T2

IXTP90N055T2

Wickmann / Littelfuse

MOSFET N-CH 55V 90A TO220AB

0

IXTH96N25T

IXTH96N25T

Wickmann / Littelfuse

MOSFET N-CH 250V 96A TO247

540

IXTK20N150

IXTK20N150

Wickmann / Littelfuse

MOSFET N-CH 1500V 20A TO264

3175

IXFP5N100PM

IXFP5N100PM

Wickmann / Littelfuse

MOSFET N-CH 1000V 2.3A TO220

3

IXFK52N100X

IXFK52N100X

Wickmann / Littelfuse

MOSFET N-CH 1000V 52A TO264

0

IXFH30N50P

IXFH30N50P

Wickmann / Littelfuse

MOSFET N-CH 500V 30A TO247AD

0

IXTY2N100P

IXTY2N100P

Wickmann / Littelfuse

MOSFET N-CH 1000V 2A TO252

1190

IXFA220N06T3

IXFA220N06T3

Wickmann / Littelfuse

MOSFET N-CH 60V 220A TO263

1650

IXFH110N25T

IXFH110N25T

Wickmann / Littelfuse

MOSFET N-CH 250V 110A TO247AD

0

IXFN44N100Q3

IXFN44N100Q3

Wickmann / Littelfuse

MOSFET N-CH 1000V 38A SOT227B

11

IXFQ22N60P3

IXFQ22N60P3

Wickmann / Littelfuse

MOSFET N-CH 600V 22A TO3P

1230

IXFX420N10T

IXFX420N10T

Wickmann / Littelfuse

MOSFET N-CH 100V 420A PLUS247-3

0

IXTT100N25P

IXTT100N25P

Wickmann / Littelfuse

MOSFET N-CH 250V 100A TO268

3120

IXFX220N17T2

IXFX220N17T2

Wickmann / Littelfuse

MOSFET N-CH 170V 220A PLUS247-3

3510

VMO1200-01F

VMO1200-01F

Wickmann / Littelfuse

MOSFET N-CH 100V 1220A Y3-LI

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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