Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXFA16N50P

IXFA16N50P

Wickmann / Littelfuse

MOSFET N-CH 500V 16A TO263

350

IXFK32N80Q3

IXFK32N80Q3

Wickmann / Littelfuse

MOSFET N-CH 800V 32A TO264AA

1025

IXTA130N10T

IXTA130N10T

Wickmann / Littelfuse

MOSFET N-CH 100V 130A TO263

543

IXTX46N50L

IXTX46N50L

Wickmann / Littelfuse

MOSFET N-CH 500V 46A PLUS247-3

880690

IXFK120N30T

IXFK120N30T

Wickmann / Littelfuse

MOSFET N-CH 300V 120A TO264AA

3525

IXFH230N075T2

IXFH230N075T2

Wickmann / Littelfuse

MOSFET N-CH 75V 230A TO247AD

870

IXTY10P15T

IXTY10P15T

Wickmann / Littelfuse

MOSFET P-CH 150V 10A TO252

1120

IXFB60N80P

IXFB60N80P

Wickmann / Littelfuse

MOSFET N-CH 800V 60A PLUS264

75

IXFA18N60X

IXFA18N60X

Wickmann / Littelfuse

MOSFET N-CH 600V 18A TO263AA

800

IXTT64N25P

IXTT64N25P

Wickmann / Littelfuse

MOSFET N-CH 250V 64A TO268

2850

IXTP1R6N50D2

IXTP1R6N50D2

Wickmann / Littelfuse

MOSFET N-CH 500V 1.6A TO220AB

67800

IXFP10N80P

IXFP10N80P

Wickmann / Littelfuse

MOSFET N-CH 800V 10A TO220AB

0

IXFR102N30P

IXFR102N30P

Wickmann / Littelfuse

MOSFET N-CH 300V 60A ISOPLUS247

1260

IXTP62N15P

IXTP62N15P

Wickmann / Littelfuse

MOSFET N-CH 150V 62A TO220AB

92150

IXFR36N50P

IXFR36N50P

Wickmann / Littelfuse

MOSFET N-CH 500V 19A ISOPLUS247

210

IXTA340N04T4

IXTA340N04T4

Wickmann / Littelfuse

MOSFET N-CH 40V 340A TO263AA

1100

IXFX24N100Q3

IXFX24N100Q3

Wickmann / Littelfuse

MOSFET N-CH 1000V 24A PLUS247-3

0

IXFB90N85X

IXFB90N85X

Wickmann / Littelfuse

MOSFET N-CH 850V 90A PLUS264

0

IXTP4N65X2

IXTP4N65X2

Wickmann / Littelfuse

MOSFET N-CH 650V 4A TO220

2932650

IXFJ80N25X3

IXFJ80N25X3

Wickmann / Littelfuse

MOSFET N-CH 250V 44A ISO TO247-3

450

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

RFQ BOM Call Skype Email
Top