Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SISA35DN-T1-GE3

SISA35DN-T1-GE3

Vishay / Siliconix

MOSFET P-CH 30V 10A/16A PPAK

8346

IRF9Z30PBF-BE3

IRF9Z30PBF-BE3

Vishay / Siliconix

MOSFET P-CH 50V 18A TO220AB

1000

SQ2319ADS-T1_GE3

SQ2319ADS-T1_GE3

Vishay / Siliconix

MOSFET P-CH 40V 4.6A SOT23-3

318

SI4896DY-T1-GE3

SI4896DY-T1-GE3

Vishay / Siliconix

MOSFET N-CH 80V 6.7A 8SO

8872

SQM50P04-09L_GE3

SQM50P04-09L_GE3

Vishay / Siliconix

MOSFET P-CHANNEL 40V 50A TO263

665

SI2312BDS-T1-GE3

SI2312BDS-T1-GE3

Vishay / Siliconix

MOSFET N-CH 20V 3.9A SOT23-3

23238

IRLR024TRL

IRLR024TRL

Vishay / Siliconix

MOSFET N-CH 60V 14A DPAK

0

SI7738DP-T1-E3

SI7738DP-T1-E3

Vishay / Siliconix

MOSFET N-CH 150V 30A PPAK SO-8

2787

IRF520PBF-BE3

IRF520PBF-BE3

Vishay / Siliconix

MOSFET N-CH 100V 9.2A TO220AB

971

SQM120P06-07L_GE3

SQM120P06-07L_GE3

Vishay / Siliconix

MOSFET P-CH 60V 120A TO263

12974

SIS780DN-T1-GE3

SIS780DN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 18A PPAK1212-8

1857

SQJ465EP-T1_GE3

SQJ465EP-T1_GE3

Vishay / Siliconix

MOSFET P-CH 60V 8A PPAK SO-8

1146

SIR800DP-T1-GE3

SIR800DP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 20V 50A PPAK SO-8

1934

SI7858BDP-T1-GE3

SI7858BDP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 12V 40A PPAK SO-8

18917

SIHG20N50C-E3

SIHG20N50C-E3

Vishay / Siliconix

MOSFET N-CH 500V 20A TO247AC

7493

SIHA20N50E-E3

SIHA20N50E-E3

Vishay / Siliconix

MOSFET N-CH 500V 19A TO220

32

SI7868ADP-T1-GE3

SI7868ADP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 20V 40A PPAK SO-8

0

SQS401EN-T1_GE3

SQS401EN-T1_GE3

Vishay / Siliconix

MOSFET P-CH 40V 16A PPAK1212-8

11295

SQD45N05-20L-GE3

SQD45N05-20L-GE3

Vishay / Siliconix

MOSFET N-CH 50V 50A TO252

0

SISA66DN-T1-GE3

SISA66DN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 40A PPAK1212-8

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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