Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SISC06DN-T1-GE3

SISC06DN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 27.6A/40A PPAK

5970

SI1330EDL-T1-E3

SI1330EDL-T1-E3

Vishay / Siliconix

MOSFET N-CH 60V 240MA SC70-3

18542

IRF9Z14STRLPBF

IRF9Z14STRLPBF

Vishay / Siliconix

MOSFET P-CH 60V 6.7A D2PAK

0

SIHP33N60EF-GE3

SIHP33N60EF-GE3

Vishay / Siliconix

MOSFET N-CH 600V 33A TO220AB

317

IRLR120TRRPBF

IRLR120TRRPBF

Vishay / Siliconix

MOSFET N-CH 100V 7.7A DPAK

0

SIRA54DP-T1-GE3

SIRA54DP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 40V 60A PPAK SO-8

21

SIHP30N60E-GE3

SIHP30N60E-GE3

Vishay / Siliconix

MOSFET N-CH 600V 29A TO220AB

824

SQD50N10-8M9L_GE3

SQD50N10-8M9L_GE3

Vishay / Siliconix

MOSFET N-CH 100V 50A TO252AA

764

SI4434DY-T1-GE3

SI4434DY-T1-GE3

Vishay / Siliconix

MOSFET N-CH 250V 2.1A 8SO

4320

SUD19P06-60-E3

SUD19P06-60-E3

Vishay / Siliconix

MOSFET P-CH 60V 18.3A TO252

717

SQJA02EP-T1_GE3

SQJA02EP-T1_GE3

Vishay / Siliconix

MOSFET N-CH 60V 60A PPAK SO-8

115

SQA405EJ-T1_GE3

SQA405EJ-T1_GE3

Vishay / Siliconix

MOSFET P-CH 40V 10A PPAK SC70-6

0

SQ4435EY-T1_BE3

SQ4435EY-T1_BE3

Vishay / Siliconix

MOSFET P-CHANNEL 30V 15A 8SOIC

2495

SQ1421EDH-T1_GE3

SQ1421EDH-T1_GE3

Vishay / Siliconix

MOSFET P-CH 60V 1.6A SC70-6

3167

SUD50N06-09L-E3

SUD50N06-09L-E3

Vishay / Siliconix

MOSFET N-CH 60V 50A TO252

0

TN2404K-T1-GE3

TN2404K-T1-GE3

Vishay / Siliconix

MOSFET N-CH 240V 200MA SOT23-3

2683

IRFR9220TRPBF

IRFR9220TRPBF

Vishay / Siliconix

MOSFET P-CH 200V 3.6A DPAK

0

SIA437DJ-T1-GE3

SIA437DJ-T1-GE3

Vishay / Siliconix

MOSFET P-CH 20V 29.7A PPAK SC70

947

SQJ158EP-T1_GE3

SQJ158EP-T1_GE3

Vishay / Siliconix

MOSFET N-CH 60V 23A PPAK SO-8

945

SIJA58ADP-T1-GE3

SIJA58ADP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 40V 32.3A/109A PPAK

6018

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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