Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SI4776DY-T1-GE3

SI4776DY-T1-GE3

Vishay / Siliconix

MOSFET N-CHANNEL 30V 11.9A 8SO

1765

SI4686DY-T1-GE3

SI4686DY-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 18.2A 8SO

2000

SIA416DJ-T1-GE3

SIA416DJ-T1-GE3

Vishay / Siliconix

MOSFET N-CH 100V 11.3A PPAK

2500

SQ4483EY-T1_BE3

SQ4483EY-T1_BE3

Vishay / Siliconix

MOSFET P-CHANNEL 30V 30A 8SOIC

2410

SQD40081EL_GE3

SQD40081EL_GE3

Vishay / Siliconix

MOSFET P-CH 40V 50A TO252AA

1064

SUD50P08-25L-BE3

SUD50P08-25L-BE3

Vishay / Siliconix

MOSFET P-CH 80V 12.5A/50A DPAK

1998

SQS484ENW-T1_GE3

SQS484ENW-T1_GE3

Vishay / Siliconix

MOSFET N-CH 40V 16A PPAK1212-8

6064

SIHA21N65EF-E3

SIHA21N65EF-E3

Vishay / Siliconix

MOSFET N-CH 650V 21A TO220

0

SIHG25N60EFL-GE3

SIHG25N60EFL-GE3

Vishay / Siliconix

MOSFET N-CH 600V 25A TO247AC

370

SQ2361ES-T1_GE3

SQ2361ES-T1_GE3

Vishay / Siliconix

MOSFET P-CH 60V 2.8A SSOT23

114278

SIRA10BDP-T1-GE3

SIRA10BDP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 30A/60A PPAK SO8

2985

SQS423EN-T1_GE3

SQS423EN-T1_GE3

Vishay / Siliconix

MOSFET P-CH 30V 16A PPAK1212-8

2481

SISS42DN-T1-GE3

SISS42DN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 100V 11.8/40.5A PPAK

0

SIHW33N60E-GE3

SIHW33N60E-GE3

Vishay / Siliconix

MOSFET N-CH 600V 33A TO247AD

330

SQD30N05-20L_GE3

SQD30N05-20L_GE3

Vishay / Siliconix

MOSFET N-CH 55V 30A TO252AA

1592

SIS322DNT-T1-GE3

SIS322DNT-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 38.3A PPAK1212-8

0

IRL530PBF

IRL530PBF

Vishay / Siliconix

MOSFET N-CH 100V 15A TO220AB

0

SUM110P04-05-E3

SUM110P04-05-E3

Vishay / Siliconix

MOSFET P-CH 40V 110A TO263

20555

IRL620SPBF

IRL620SPBF

Vishay / Siliconix

MOSFET N-CH 200V 5.2A D2PAK

631

SQ2398ES-T1_BE3

SQ2398ES-T1_BE3

Vishay / Siliconix

MOSFET N-CH 100V 1.6A SOT23-3

2989

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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