Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SSM3K44MFV,L3F

SSM3K44MFV,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 100MA VESM

19405

TPCP8J01(TE85L,F,M

TPCP8J01(TE85L,F,M

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 32V 5.5A PS-8

0

TK28V65W,LQ

TK28V65W,LQ

Toshiba Electronic Devices and Storage Corporation

X35 PB-F POWER MOSFET TRANSISTOR

4970

TK3R2A10PL,S4X

TK3R2A10PL,S4X

Toshiba Electronic Devices and Storage Corporation

X35 PB-F POWER MOSFET TRANSISTOR

28

TK110P10PL,RQ

TK110P10PL,RQ

Toshiba Electronic Devices and Storage Corporation

X35 PB-F POWER MOSFET TRANSISTOR

3463

TK099V65Z,LQ

TK099V65Z,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 30A 5DFN

932

TK49N65W5,S1F

TK49N65W5,S1F

Toshiba Electronic Devices and Storage Corporation

X35 PB-F POWER MOSFET TRANSISTOR

118

TK1K0A60F,S4X

TK1K0A60F,S4X

Toshiba Electronic Devices and Storage Corporation

X35 PB-F POWER MOSFET TRANSISTOR

195

SSM3J145TU,LF

SSM3J145TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 3A UFM

5256

SSM6G18NU,LF

SSM6G18NU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 2A 6UDFN

6000

SSM6K204FE,LF

SSM6K204FE,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 2A ES6

0

TK14C65W,S1Q

TK14C65W,S1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 13.7A I2PAK

0

TPCF8B01(TE85L,F,M

TPCF8B01(TE85L,F,M

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 2.7A VS-8

0

SSM3J129TU(TE85L)

SSM3J129TU(TE85L)

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 4.6A UFM

0

2SK3128(Q)

2SK3128(Q)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 60A TO3P

0

2SJ438,MDKQ(J

2SJ438,MDKQ(J

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH TO220NIS

0

TK4A65DA(STA4,Q,M)

TK4A65DA(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 3.5A TO220SIS

0

TK16C60W,S1VQ

TK16C60W,S1VQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 15.8A I2PAK

0

TK55D10J1(Q)

TK55D10J1(Q)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 55A TO220

0

2SK3670,F(J

2SK3670,F(J

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH TO92MOD

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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