Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TK160F10N1,LXGQ

TK160F10N1,LXGQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 160A TO220SM

750

TPN8R903NL,LQ

TPN8R903NL,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 20A 8TSON

2015

TK39N60W,S1VF

TK39N60W,S1VF

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 600V 38.8A TO247

6

TK6R7P06PL,RQ

TK6R7P06PL,RQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CHANNEL 60V 46A DPAK

0

SSM3J332R,LF

SSM3J332R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 30V 6A SOT23F

94551

SSM3K15AFS,LF

SSM3K15AFS,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 100MA SSM

48352

TK16G60W,RVQ

TK16G60W,RVQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 600V 15.8A D2PAK

0

TK4R3A06PL,S4X

TK4R3A06PL,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 68A TO220SIS

50

SSM3K361R,LXHF

SSM3K361R,LXHF

Toshiba Electronic Devices and Storage Corporation

AECQ MOSFET NCH 100V 3.5A SOT23F

6000

TK35A65W5,S5X

TK35A65W5,S5X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 35A TO220SIS

76

TPN2R203NC,L1Q

TPN2R203NC,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 45A 8TSON

2395

TK11P65W,RQ

TK11P65W,RQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 11.1A DPAK

0

TPCA8052-H(T2L1,VM

TPCA8052-H(T2L1,VM

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 20A 8SOP

5

TPN2010FNH,L1Q

TPN2010FNH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 250V 5.6A 8TSON

2244

SSM3K37MFV,L3F

SSM3K37MFV,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 250MA VESM

0

TK55S10N1,LQ

TK55S10N1,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 55A DPAK

1816

TK14A65W5,S5X

TK14A65W5,S5X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 13.7A TO220SIS

50

TPCA8062-H,LQ(CM

TPCA8062-H,LQ(CM

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 28A 8SOP

0

TPW1R306PL,L1Q

TPW1R306PL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 260A 8DSOP

11663

TPH8R80ANH,L1Q

TPH8R80ANH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 100V 32A 8-SOP

10812

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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