Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
STB22N60DM6 STMicroelectronics	MOSFET N-CH 600V 15A D2PAK	0
STQ2HNK60ZR-AP STMicroelectronics	MOSFET N-CH 600V 500MA TO92-3	8498
STD2NK100Z STMicroelectronics	MOSFET N-CH 1000V 1.85A DPAK	1411
STD2N105K5 STMicroelectronics	MOSFET N-CH 1050V 1.5A DPAK	5932
STP220N6F7 STMicroelectronics	MOSFET N-CH 60V 120A TO220	384
STB43N60DM2 STMicroelectronics	MOSFET N-CH 600V 34A D2PAK	0
STD3NK60ZT4 STMicroelectronics	MOSFET N-CH 600V 2.4A DPAK	0
STB6NK90ZT4 STMicroelectronics	MOSFET N-CH 900V 5.8A D2PAK	0
STP7NK80ZFP STMicroelectronics	MOSFET N-CH 800V 5.2A TO220FP	1037
STL24N60M2 STMicroelectronics	MOSFET N-CH 600V 18A PWRFLAT HV	2970
STU9N60M2 STMicroelectronics	MOSFET N-CH 600V 5.5A IPAK	2990
STL110N10F7 STMicroelectronics	MOSFET N-CH 100V 107A POWERFLAT	199
STL19N60DM2 STMicroelectronics	MOSFET N-CH 600V 11A PWRFLAT HV	110
STW28N60M2 STMicroelectronics	MOSFET N-CH 600V 24A TO247	289
STH175N4F6-2AG STMicroelectronics	MOSFET N-CH 40V 120A H2PAK-2	0
STI18N65M2 STMicroelectronics	MOSFET N-CH 650V 12A I2PAK	845
STP45N60DM6 STMicroelectronics	MOSFET N-CH 600V 30A TO220	17
STP20NM60FP STMicroelectronics	MOSFET N-CH 600V 20A TO220FP	739
STWA48N60DM2 STMicroelectronics	MOSFET N-CH 600V 40A TO247	320
STD7N65M2 STMicroelectronics	MOSFET N-CH 650V 5A DPAK	0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS