Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
RJK03M8DNS-WS#J5

RJK03M8DNS-WS#J5

Renesas Electronics America

N-CHANNEL POWER MOSFET

4880

2SK3109-AZ

2SK3109-AZ

Renesas Electronics America

N-CHANNEL POWER MOSFET

4900

UPA1818GR-9JG-E1-A

UPA1818GR-9JG-E1-A

Renesas Electronics America

MOSFET P-CH 20V 10A 8TSSOP

3000

2SK2008-E

2SK2008-E

Renesas Electronics America

N-CHANNEL POWER MOSFET

0

2SK1947-E

2SK1947-E

Renesas Electronics America

N-CHANNEL POWER MOSFET

534

NP36P06KDG-E1-AY

NP36P06KDG-E1-AY

Renesas Electronics America

MOSFET P-CH 60V 36A TO263

0

UPA2825T1S-E2-AT

UPA2825T1S-E2-AT

Renesas Electronics America

MOSFET N-CH 30V 8HVSON

0

RJK0855DPB-00#J5

RJK0855DPB-00#J5

Renesas Electronics America

MOSFET N-CH 80V 30A LFPAK

1252

NP88N055MHE-S18-AY

NP88N055MHE-S18-AY

Renesas Electronics America

N-CHANNEL POWER MOSFET

4700

N0602N-S19-AY

N0602N-S19-AY

Renesas Electronics America

MOSFET N-CH 60V 100A TO220-3

2000

UPA2701GR-E1-AT

UPA2701GR-E1-AT

Renesas Electronics America

MOSFET N-CH 30V 14A 8PSOP

20000

UPA1820GR-9JG-E1-A

UPA1820GR-9JG-E1-A

Renesas Electronics America

MOSFET N-CH 20V 12A 8TSSOP

21000

2SK3115-AZ

2SK3115-AZ

Renesas Electronics America

N-CHANNEL POWER MOSFET

49366

2SJ326-AZ

2SJ326-AZ

Renesas Electronics America

P-CHANNEL SMALL SIGNAL MOSFET

0

RJK0332DPB-00#J0

RJK0332DPB-00#J0

Renesas Electronics America

MOSFET N-CH 30V 35A LFPAK

0

2SK2738-E

2SK2738-E

Renesas Electronics America

N-CHANNEL POWER MOSFET

289

UPA2727UT1A-E1-AY

UPA2727UT1A-E1-AY

Renesas Electronics America

MOSFET N-CH 30V 16A 8DFN

3000

NP15P06SLG-E1-AY

NP15P06SLG-E1-AY

Renesas Electronics America

MOSFET P-CH 60V 15A TO252

0

2SK1317-E

2SK1317-E

Renesas Electronics America

MOSFET N-CH 1500V 2.5A TO3P

0

HAT2054M-EL-E

HAT2054M-EL-E

Renesas Electronics America

MOSFET N-CH 30V 6.3A 6TSOP

10605

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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