Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IRFR010PBF-BE3

IRFR010PBF-BE3

Vishay / Siliconix

MOSFET N-CH 50V 8.2A DPAK

2990

STF15N95K5

STF15N95K5

STMicroelectronics

MOSFET N-CH 950V 12A TO220FP

767

BUK964R4-40B,118

BUK964R4-40B,118

Nexperia

MOSFET N-CH 40V 75A D2PAK

8775

IRFR3711ZTRPBF

IRFR3711ZTRPBF

IR (Infineon Technologies)

MOSFET N-CH 20V 93A DPAK

4205

STL260N4F7

STL260N4F7

STMicroelectronics

MOSFET N-CH 40V 120A POWERFLAT

11

NDF02N60ZG

NDF02N60ZG

Sanyo Denki SanUPS Products

MOSFET N-CH 600V 2.4A TO220-3

183327

MCAC80N06Y-TP

MCAC80N06Y-TP

Micro Commercial Components (MCC)

MOSFET N-CH 60V 80A DFN5060

13642

TK40E06N1,S1X

TK40E06N1,S1X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 40A TO220

21

IPB80N06S2LH5

IPB80N06S2LH5

IR (Infineon Technologies)

N-CHANNEL POWER MOSFET

5000

NVMFS6H824NT1G

NVMFS6H824NT1G

Sanyo Semiconductor/ON Semiconductor

MOSFET N-CH 80V 19A/103A 5DFN

2

RF1K4909096

RF1K4909096

N-CHANNEL POWER MOSFET

60849

SQ4153EY-T1_BE3

SQ4153EY-T1_BE3

Vishay / Siliconix

MOSFET P-CHANNEL 12V 25A 8SOIC

2470

SSM5N15FE(TE85L,F)

SSM5N15FE(TE85L,F)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 100MA ESV

51

FDA28N50

FDA28N50

Sanyo Semiconductor/ON Semiconductor

MOSFET N-CH 500V 28A TO3PN

216

PSMN010-25YLC,115

PSMN010-25YLC,115

NXP Semiconductors

MOSFET N-CH 25V 39A LFPAK56

4030

DMP4015SK3Q-13

DMP4015SK3Q-13

Zetex Semiconductors (Diodes Inc.)

MOSFET P-CH 40V 14A/35A TO252

0

SPD30N03S2L07GBTMA1

SPD30N03S2L07GBTMA1

IR (Infineon Technologies)

MOSFET N-CH 30V 30A TO252-3

7500

CSD18511Q5AT

CSD18511Q5AT

Texas Instruments

MOSFET N-CH 40V 159A 8VSON

552

AON6558

AON6558

Alpha and Omega Semiconductor, Inc.

MOSFET N-CH 30V 25A/28A 8DFN

943

FQD1N80TM

FQD1N80TM

Sanyo Semiconductor/ON Semiconductor

MOSFET N-CH 800V 1A DPAK

1566

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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