Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
FDS7088N3	MOSFET N-CH 30V 21A 8SO	4530
RM2302 Rectron USA	MOSFET N-CHANNEL 20V 4A SOT23	0
NDS352P	MOSFET P-CH 20V 850MA SUPERSOT3	44183
IMW120R220M1HXKSA1 IR (Infineon Technologies)	SICFET N-CH 1.2KV 13A TO247-3	696
TK46A08N1,S4X Toshiba Electronic Devices and Storage Corporation	MOSFET N-CH 80V 46A TO220SIS	0
IRF740B	MOSFET N-CH 400V 10A TO220-3	5113
FDU3N40TU	POWER FIELD-EFFECT TRANSISTOR, 2	10080
SI3493DDV-T1-GE3 Vishay / Siliconix	MOSFET P-CHANNEL 20V 8A 6TSOP	1934
IRFB9N60APBF-BE3 Vishay / Siliconix	MOSFET N-CH 600V 9.2A TO220AB	999
STP140NF55 STMicroelectronics	MOSFET N-CH 55V 80A TO220AB	866
FDS6375 Sanyo Semiconductor/ON Semiconductor	MOSFET P-CH 20V 8A 8SOIC	6833
IRLMS6702TRPBF IR (Infineon Technologies)	MOSFET P-CH 20V 2.4A MICRO6	2080
NVTFS4C13NWFTWG Sanyo Semiconductor/ON Semiconductor	MOSFET N-CH 30V 14A 8WDFN	0
AOTF600A60L Alpha and Omega Semiconductor, Inc.	MOSFET N-CH 600V 8A TO220F	999
AUIRL3705ZS IR (Infineon Technologies)	MOSFET N-CH 55V 75A D2PAK	5600
SQ2325ES-T1_GE3 Vishay / Siliconix	MOSFET P-CH 150V 840MA TO236	7894
IPN60R360PFD7SATMA1 IR (Infineon Technologies)	MOSFET N-CH 650V 10A SOT223	2706
FQPF1N50	MOSFET N-CH 500V 900MA TO220F	0
IPB080N06N G IR (Infineon Technologies)	MOSFET N-CH 60V 80A TO263-3	18
AO3418 Alpha and Omega Semiconductor, Inc.	MOSFET N-CH 30V 3.8A SOT23-3L	22267

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS