Transistors - Bipolar (BJT) - RF

Image Part Number Description / PDF Quantity Rfq
2SC4562GRL

2SC4562GRL

Panasonic

RF TRANS NPN 50V 250MHZ SMINI3

5820

BFG97,115

BFG97,115

NXP Semiconductors

RF SMALL SIGNAL BIPOLAR TRANSIST

44000

BFR35APE6327HTSA1

BFR35APE6327HTSA1

IR (Infineon Technologies)

RF TRANS NPN 15V 5GHZ SOT23-3

0

BFP450

BFP450

IR (Infineon Technologies)

RF SMALL SIGNAL BIPOLAR TRANSIST

130871

BFR360FH6327XTSA1

BFR360FH6327XTSA1

IR (Infineon Technologies)

RF TRANS NPN 9V 14GHZ TSFP-3

40519

MMBTH81

MMBTH81

Sanyo Semiconductor/ON Semiconductor

RF TRANS PNP 20V 600MHZ SOT23-3

54776

2SC5347AF-TD-E

2SC5347AF-TD-E

Sanyo Semiconductor/ON Semiconductor

RF TRANS NPN 12V 4.7GHZ PCP

746

BF240

BF240

GENERAL PURPOSE NPN TRANSISTOR

6300

2SC5536A-TL-H

2SC5536A-TL-H

Sanyo Semiconductor/ON Semiconductor

RF TRANS NPN 12V 1.7GHZ 3SSFP

2147483647

MRF426

MRF426

Metelics (MACOM Technology Solutions)

TRANS RF NPN 35V 3A 211-07

0

2N5179 PBFREE

2N5179 PBFREE

Central Semiconductor

RF TRANS NPN 12V 2GHZ TO72

69

2SC39310CL

2SC39310CL

Panasonic

RF TRANS NPN 20V 650MHZ SMINI3

191

BFU520VL

BFU520VL

NXP Semiconductors

RF TRANS NPN 12V 10.5GHZ SOT143B

0

BFP193E6327HTSA1

BFP193E6327HTSA1

IR (Infineon Technologies)

RF TRANS NPN 12V 8GHZ SOT143-4

8448

BGR405H6327XTSA1

BGR405H6327XTSA1

IR (Infineon Technologies)

RF SMALL SIGNAL TRANSISTOR

939000

HFA3102BZ96

HFA3102BZ96

Intersil (Renesas Electronics America)

RF TRANS 6 NPN 12V 10GHZ 14SOIC

1162

15GN03CA-TB-E

15GN03CA-TB-E

Sanyo Semiconductor/ON Semiconductor

RF TRANS NPN 10V 1.5GHZ 3CP

3716

MT4S300U(TE85L,O,F

MT4S300U(TE85L,O,F

Toshiba Electronic Devices and Storage Corporation

X34 PB-F RADIO-FREQUENCY SIGE HE

8288

BFR183E6327

BFR183E6327

BFR183 - LOW-NOISE SI TRANSISTOR

31800

BFR35AP

BFR35AP

IR (Infineon Technologies)

BFR35 - LOW-NOISE SI TRANSISTORS

3001

Transistors - Bipolar (BJT) - RF

1. Overview

Radio Frequency Bipolar Junction Transistors (RF BJTs) are three-layer semiconductor devices optimized for amplification and switching in high-frequency applications (typically >100 MHz). These transistors maintain stable performance in microwave and ultra-high frequency (UHF) ranges, characterized by high current gain-bandwidth product (fT), low noise figures, and fast switching capabilities. Their importance in modern technology spans wireless communication infrastructure, radar systems, and RF test equipment, enabling efficient signal transmission and reception in 5G networks, satellite communications, and IoT devices.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
NPN RF BJTHigh electron mobility, optimized for low-noise amplification5G base station LNAs, GPS receivers
PNP RF BJTComplementary design for power amplificationRF power modules, automotive radar
RF Darlington PairHigh (current gain), cascaded amplificationAntenna drivers, industrial RF heaters
Heterojunction Bipolar Transistor (HBT)Compound semiconductor materials (SiGe/GaAs), ultra-high fTOptical communication transceivers, mmWave systems

3. Structure & Composition

Typical RF BJT structure includes:

  • Material: Silicon (Si), Silicon-Germanium (SiGe), Gallium Arsenide (GaAs)
  • Layer Architecture: Emitter (high doping), Base (thin layer), Collector (graded doping)
  • Package Types: Surface-mount (SOT-89, SOT-343), Through-hole (TO-18, TO-92)
  • Metallization: Gold/aluminum contacts for reduced parasitic resistance

Advanced designs incorporate air-bridge structures to minimize parasitic capacitance and epitaxial layers for improved frequency response.

4. Key Technical Parameters

ParameterDescriptionTypical Range
fT (Transition Frequency)Current gain cutoff frequency1 GHz - 100 GHz
GUM (Max. Available Gain)Power gain at optimal impedance10 dB - 30 dB
Pout (Output Power)RMS power capability0.1 W - 500 W
NF (Noise Figure)Signal-to-noise degradation0.3 dB - 5 dB
VCE0 (Breakdown Voltage)Collector-emitter withstand voltage5 V - 80 V
(Junction Temperature)Thermal stability limit150 C - 200 C

5. Application Fields

  • Telecommunications: 5G massive MIMO amplifiers, fiber optic transceivers
  • Defense: Phased array radar systems, electronic warfare jammers
  • Test & Measurement: RF signal generators, spectrum analyzers
  • Consumer Electronics: Bluetooth LE modules, Wi-Fi 6E front-ends
  • Industrial: Plasma generators, RFID readers

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specifications
Infineon TechnologiesBFP740FfT=50 GHz, NF=0.8 dB, Pout=18 dBm
STMicroelectronicsSTAG21412.7 GHz dual-stage amplifier, 32 dB gain
Skyworks SolutionsASK240110.05-6 GHz, 50 W GaAs power transistor
ON SemiconductorMRF151G125 W, 880 MHz, 40% efficiency

7. Selection Guidelines

Key considerations:

  1. Match fT to application frequency with 20% margin
  2. Verify load-line requirements for power applications
  3. Select appropriate package for thermal dissipation (e.g., TO-220 for >50 W)
  4. Derate VCE0 by 30% in high-temperature environments
  5. Consider integrated solutions (RFICs) for complex impedance matching

8. Industry Trends

Future development directions:

  • Transition to SiGe BiCMOS technology for 100+ GHz applications
  • Integration with GaN-on-SiC substrates for hybrid power amplifiers
  • Development of 5G NR direct-conversion transmitters using HBT arrays
  • Advancements in wafer-level packaging (WLP) for mmWave 5G devices
  • Adoption of AI-driven parameter optimization in production testing
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