Transistors - Bipolar (BJT) - RF

Image Part Number Description / PDF Quantity Rfq
MRF4427

MRF4427

Microsemi

RF TRANS NPN 20V 8SO

0

PN3563_D26Z

PN3563_D26Z

Sanyo Semiconductor/ON Semiconductor

RF TRANS NPN 15V 1.5GHZ TO92-3

0

BFS17A,235

BFS17A,235

NXP Semiconductors

RF TRANS NPN 15V 2.8GHZ TO236AB

0

2SC4227-A

2SC4227-A

CEL (California Eastern Laboratories)

RF TRANS NPN 10V 7GHZ SC70

0

NE68030-A

NE68030-A

CEL (California Eastern Laboratories)

RF TRANS NPN 10V 10GHZ SOT323

0

UPA814T-T1

UPA814T-T1

CEL (California Eastern Laboratories)

RF TRANS 2 NPN 6V 9GHZ 6SO

0

2SC4094-T1-A

2SC4094-T1-A

CEL (California Eastern Laboratories)

RF TRANS NPN 10V 9GHZ SOT143

0

NE46134-AZ

NE46134-AZ

CEL (California Eastern Laboratories)

RF TRANS NPN 15V 5.5GHZ SOT89

0

AT-41532-TR2G

AT-41532-TR2G

Broadcom

RF TRANS NPN 12V SC70-3

0

MRF553T

MRF553T

Microsemi

RF TRNS NPN 16V 175MHZ PWR MACRO

0

BFR 182 B6663

BFR 182 B6663

IR (Infineon Technologies)

RF TRANS NPN 12V 8GHZ SOT23-3

0

BFG93A,215

BFG93A,215

NXP Semiconductors

RF TRANS NPN 12V 6GHZ SOT143B

0

BF 775 E6327

BF 775 E6327

IR (Infineon Technologies)

RF TRANS NPN 15V 5GHZ SOT23-3

0

MMBTH10-4LT1

MMBTH10-4LT1

Sanyo Semiconductor/ON Semiconductor

RF TRANS NPN 25V 800MHZ SOT23-3

0

AT-32063-TR2G

AT-32063-TR2G

Broadcom

RF TRANS 2 NPN 5.5V SOT363

0

75102

75102

Microsemi

RF POWER TRANSISTOR

0

NE85633-T1B-R23-A

NE85633-T1B-R23-A

CEL (California Eastern Laboratories)

RF TRANS NPN 12V 7GHZ SOT23

0

2N5109

2N5109

Microsemi

RF TRANS NPN 20V 1.2GHZ TO39

0

BFS 481 E6327

BFS 481 E6327

IR (Infineon Technologies)

RF TRANS 2 NPN 12V 8GHZ SOT363-6

0

MPS5179RLRAG

MPS5179RLRAG

Sanyo Semiconductor/ON Semiconductor

RF TRANS NPN 12V 2GHZ TO92-3

0

Transistors - Bipolar (BJT) - RF

1. Overview

Radio Frequency Bipolar Junction Transistors (RF BJTs) are three-layer semiconductor devices optimized for amplification and switching in high-frequency applications (typically >100 MHz). These transistors maintain stable performance in microwave and ultra-high frequency (UHF) ranges, characterized by high current gain-bandwidth product (fT), low noise figures, and fast switching capabilities. Their importance in modern technology spans wireless communication infrastructure, radar systems, and RF test equipment, enabling efficient signal transmission and reception in 5G networks, satellite communications, and IoT devices.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
NPN RF BJTHigh electron mobility, optimized for low-noise amplification5G base station LNAs, GPS receivers
PNP RF BJTComplementary design for power amplificationRF power modules, automotive radar
RF Darlington PairHigh (current gain), cascaded amplificationAntenna drivers, industrial RF heaters
Heterojunction Bipolar Transistor (HBT)Compound semiconductor materials (SiGe/GaAs), ultra-high fTOptical communication transceivers, mmWave systems

3. Structure & Composition

Typical RF BJT structure includes:

  • Material: Silicon (Si), Silicon-Germanium (SiGe), Gallium Arsenide (GaAs)
  • Layer Architecture: Emitter (high doping), Base (thin layer), Collector (graded doping)
  • Package Types: Surface-mount (SOT-89, SOT-343), Through-hole (TO-18, TO-92)
  • Metallization: Gold/aluminum contacts for reduced parasitic resistance

Advanced designs incorporate air-bridge structures to minimize parasitic capacitance and epitaxial layers for improved frequency response.

4. Key Technical Parameters

ParameterDescriptionTypical Range
fT (Transition Frequency)Current gain cutoff frequency1 GHz - 100 GHz
GUM (Max. Available Gain)Power gain at optimal impedance10 dB - 30 dB
Pout (Output Power)RMS power capability0.1 W - 500 W
NF (Noise Figure)Signal-to-noise degradation0.3 dB - 5 dB
VCE0 (Breakdown Voltage)Collector-emitter withstand voltage5 V - 80 V
(Junction Temperature)Thermal stability limit150 C - 200 C

5. Application Fields

  • Telecommunications: 5G massive MIMO amplifiers, fiber optic transceivers
  • Defense: Phased array radar systems, electronic warfare jammers
  • Test & Measurement: RF signal generators, spectrum analyzers
  • Consumer Electronics: Bluetooth LE modules, Wi-Fi 6E front-ends
  • Industrial: Plasma generators, RFID readers

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specifications
Infineon TechnologiesBFP740FfT=50 GHz, NF=0.8 dB, Pout=18 dBm
STMicroelectronicsSTAG21412.7 GHz dual-stage amplifier, 32 dB gain
Skyworks SolutionsASK240110.05-6 GHz, 50 W GaAs power transistor
ON SemiconductorMRF151G125 W, 880 MHz, 40% efficiency

7. Selection Guidelines

Key considerations:

  1. Match fT to application frequency with 20% margin
  2. Verify load-line requirements for power applications
  3. Select appropriate package for thermal dissipation (e.g., TO-220 for >50 W)
  4. Derate VCE0 by 30% in high-temperature environments
  5. Consider integrated solutions (RFICs) for complex impedance matching

8. Industry Trends

Future development directions:

  • Transition to SiGe BiCMOS technology for 100+ GHz applications
  • Integration with GaN-on-SiC substrates for hybrid power amplifiers
  • Development of 5G NR direct-conversion transmitters using HBT arrays
  • Advancements in wafer-level packaging (WLP) for mmWave 5G devices
  • Adoption of AI-driven parameter optimization in production testing
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