Transistors - Bipolar (BJT) - RF

Image Part Number Description / PDF Quantity Rfq
2SC4915-O,LF

2SC4915-O,LF

Toshiba Electronic Devices and Storage Corporation

RF TRANS NPN 30V 550MHZ SSM

2463

2N2857

2N2857

Sanyo Semiconductor/ON Semiconductor

DIE RF TRANS NPN 15V

0

UPA800T-T1

UPA800T-T1

CEL (California Eastern Laboratories)

RF TRANS 2 NPN 10V 8GHZ 6SO

6

MX0912B351Y,114

MX0912B351Y,114

Ampleon

RF TRANSISTOR

131

MT3S113TU,LF

MT3S113TU,LF

Toshiba Electronic Devices and Storage Corporation

RF TRANS NPN 5.3V 11.2GHZ UFM

5800

BFP842ESDH6327XTSA1

BFP842ESDH6327XTSA1

IR (Infineon Technologies)

RF TRANS NPN 3.7V 60GHZ SOT343

5635

MMBTH10

MMBTH10

RF SMALL SIGNAL TRANSISTOR

12000

BGR420H6327

BGR420H6327

IR (Infineon Technologies)

BIASED LOW NOISE RF TRANSISTOR

222000

MZ0912B50Y,114

MZ0912B50Y,114

Ampleon

RF TRANSISTOR

1

PH2729-25M

PH2729-25M

Metelics (MACOM Technology Solutions)

RF TRANS NPN 60V

3

2SC5226A-5-TL-E

2SC5226A-5-TL-E

Sanyo Semiconductor/ON Semiconductor

RF TRANS NPN 10V 7GHZ 3MCP

118000

BFP196WH6740

BFP196WH6740

IR (Infineon Technologies)

RF TRANSISTOR, L BAND, NPN

99000

NTE55

NTE55

NTE Electronics, Inc.

RF TRANS PNP 150V 30MHZ TO220

208

BFP183E7764HTSA1

BFP183E7764HTSA1

IR (Infineon Technologies)

RF TRANS NPN 12V 8GHZ SOT143-4

7330

KSC1674CYBU

KSC1674CYBU

RF SMALL SIGNAL TRANSISTOR

30990

2SC4808G0L

2SC4808G0L

Panasonic

RF TRANS NPN 10V 6GHZ SSMINI3-F3

5980

BFR843EL3E6327XTSA1

BFR843EL3E6327XTSA1

IR (Infineon Technologies)

RF TRANS NPN 2.6V TSLP-3-10

15000

2SC4915-Y,LF

2SC4915-Y,LF

Toshiba Electronic Devices and Storage Corporation

RF TRANS NPN 30V 550MHZ SSM

31

BFR380TE6327

BFR380TE6327

IR (Infineon Technologies)

RF BIPOLAR TRANSISTOR

162000

2SC5754-T2-A

2SC5754-T2-A

Renesas Electronics America

RF 0.5A, NPN

0

Transistors - Bipolar (BJT) - RF

1. Overview

Radio Frequency Bipolar Junction Transistors (RF BJTs) are three-layer semiconductor devices optimized for amplification and switching in high-frequency applications (typically >100 MHz). These transistors maintain stable performance in microwave and ultra-high frequency (UHF) ranges, characterized by high current gain-bandwidth product (fT), low noise figures, and fast switching capabilities. Their importance in modern technology spans wireless communication infrastructure, radar systems, and RF test equipment, enabling efficient signal transmission and reception in 5G networks, satellite communications, and IoT devices.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
NPN RF BJTHigh electron mobility, optimized for low-noise amplification5G base station LNAs, GPS receivers
PNP RF BJTComplementary design for power amplificationRF power modules, automotive radar
RF Darlington PairHigh (current gain), cascaded amplificationAntenna drivers, industrial RF heaters
Heterojunction Bipolar Transistor (HBT)Compound semiconductor materials (SiGe/GaAs), ultra-high fTOptical communication transceivers, mmWave systems

3. Structure & Composition

Typical RF BJT structure includes:

  • Material: Silicon (Si), Silicon-Germanium (SiGe), Gallium Arsenide (GaAs)
  • Layer Architecture: Emitter (high doping), Base (thin layer), Collector (graded doping)
  • Package Types: Surface-mount (SOT-89, SOT-343), Through-hole (TO-18, TO-92)
  • Metallization: Gold/aluminum contacts for reduced parasitic resistance

Advanced designs incorporate air-bridge structures to minimize parasitic capacitance and epitaxial layers for improved frequency response.

4. Key Technical Parameters

ParameterDescriptionTypical Range
fT (Transition Frequency)Current gain cutoff frequency1 GHz - 100 GHz
GUM (Max. Available Gain)Power gain at optimal impedance10 dB - 30 dB
Pout (Output Power)RMS power capability0.1 W - 500 W
NF (Noise Figure)Signal-to-noise degradation0.3 dB - 5 dB
VCE0 (Breakdown Voltage)Collector-emitter withstand voltage5 V - 80 V
(Junction Temperature)Thermal stability limit150 C - 200 C

5. Application Fields

  • Telecommunications: 5G massive MIMO amplifiers, fiber optic transceivers
  • Defense: Phased array radar systems, electronic warfare jammers
  • Test & Measurement: RF signal generators, spectrum analyzers
  • Consumer Electronics: Bluetooth LE modules, Wi-Fi 6E front-ends
  • Industrial: Plasma generators, RFID readers

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specifications
Infineon TechnologiesBFP740FfT=50 GHz, NF=0.8 dB, Pout=18 dBm
STMicroelectronicsSTAG21412.7 GHz dual-stage amplifier, 32 dB gain
Skyworks SolutionsASK240110.05-6 GHz, 50 W GaAs power transistor
ON SemiconductorMRF151G125 W, 880 MHz, 40% efficiency

7. Selection Guidelines

Key considerations:

  1. Match fT to application frequency with 20% margin
  2. Verify load-line requirements for power applications
  3. Select appropriate package for thermal dissipation (e.g., TO-220 for >50 W)
  4. Derate VCE0 by 30% in high-temperature environments
  5. Consider integrated solutions (RFICs) for complex impedance matching

8. Industry Trends

Future development directions:

  • Transition to SiGe BiCMOS technology for 100+ GHz applications
  • Integration with GaN-on-SiC substrates for hybrid power amplifiers
  • Development of 5G NR direct-conversion transmitters using HBT arrays
  • Advancements in wafer-level packaging (WLP) for mmWave 5G devices
  • Adoption of AI-driven parameter optimization in production testing
RFQ BOM Call Skype Email
Top