Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
AS5163-TS_EK_DB

AS5163-TS_EK_DB

ams

BOARD DEMO AS5163

0

AS5145B-SS_EK_DB

AS5145B-SS_EK_DB

ams

BOARD DEMO AS5145

0

TSL2572EVM

TSL2572EVM

ams

BOARD EVAL FOR TSL2572

0

AS5030-TS_EK_DB

AS5030-TS_EK_DB

ams

BOARD DEMO AS5030

0

AS5263-QF_EK_AB

AS5263-QF_EK_AB

ams

ADAPTER BOARD FOR AS5263

0

AS5311-TS_EK_DB

AS5311-TS_EK_DB

ams

BOARD EVAL FOR AS5311

0

AS5145-SS_EK_DB

AS5145-SS_EK_DB

ams

DEMO BOARD FOR AS5145

0

PC404A-201R

PC404A-201R

ams

EVAL MODULE FOR PC404A-201R

0

AS5055 AB

AS5055 AB

ams

BOARD EVAL FOR AS5055

0

AS5304-TS_EK_DB

AS5304-TS_EK_DB

ams

BOARD DEMO AS5304

0

PC404A-1402R

PC404A-1402R

ams

EVAL MODULE FOR PC404A-1402R

0

PC404A-1401R

PC404A-1401R

ams

EVAL MODULE FOR PC404A-1401R

0

TCS3771EVM

TCS3771EVM

ams

EVAL MODULE FOR TCS3771

0

AS5306-TS_EK_AB

AS5306-TS_EK_AB

ams

BOARD ADAPTER AS5306

0

PC404A-202R

PC404A-202R

ams

EVAL MODULE FOR PC404A-202R

0

AS5306-TS_EK_DB

AS5306-TS_EK_DB

ams

BOARD DEMO FOR AS5306A/B

0

AS5170A-SO_EK_AB

AS5170A-SO_EK_AB

ams

EVAL BOARD FOR AS5170A

0

NANO_FIBER_DEMO_HDMI

NANO_FIBER_DEMO_HDMI

ams

NANEYE_FIBER_DEMO_OPTIC_KIT_HDMI

0

TSL3301 USB-EVM

TSL3301 USB-EVM

ams

EVAL MODULE USB FOR TSL3301

0

PTMD3782-DB

PTMD3782-DB

ams

TMD3782 PRELIMINARY DB W COLOR

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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