Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-3290 MikroElektronika	THERMO 8 CLICK	0
MIKROE-2998 MikroElektronika	HEART RATE 7 CLICK	9
MIKROE-2471 MikroElektronika	BLE 3 CLICK	21
MIKROE-2965 MikroElektronika	TOUCH KEY 4 CLICK	1
MIKROE-4144 MikroElektronika	UVC CLICK	7
MIKROE-2520 MikroElektronika	16X9 G CLICK	0
MIKROE-3879 MikroElektronika	DC MOTOR 10 CLICK	3
MIKROE-2987 MikroElektronika	HALL CURRENT 2 CLICK	9
MIKROE-3275 MikroElektronika	MAGNETIC ROTARY CLICK	7
MIKROE-2065 MikroElektronika	FORCE CLICK	8
MIKROE-3263 MikroElektronika	TEMP&HUM 8 CLICK	10
MIKROE-2551 MikroElektronika	TAMPER CLICK	0
MIKROE-3861 MikroElektronika	AD-SWIO 2 CLICK	11
MIKROE-2623 MikroElektronika	EMG CLICK BUNDLE	12
MIKROE-2578 MikroElektronika	PICTAIL PLUS CLICK ADAPTER	2
MIKROE-1638 MikroElektronika	TALK TO THINGS CLICK PACK	0
MIKROE-3191 MikroElektronika	FLASH 4 CLICK	11
MIKROE-2294 MikroElektronika	TOUCHCLAMP CLICK	0
MIKROE-4192 MikroElektronika	XSENS MTI-3 CLICK	2
MIKROE-4060 MikroElektronika	AN TO PWM CLICK	5

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems