Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-1387 MikroElektronika	BOARD ADD-ON 4-20MA R CLICK	35
PIM171 Pimoroni	MINI BLACK HAT HACK3R PCB ONLY	0
EVAL-CN0540-ARDZ Analog Devices, Inc.	IEPE CBM DAQ BOARD	0
PIM027 Pimoroni	FLOTILLA MOTION ACCELEROMETER	20
MIKROE-2858 MikroElektronika	MCP73871 CLICK	2
MIKROE-2440 MikroElektronika	GSM/GNSS 2 CLICK	12
MIKROE-923 MikroElektronika	BOARD ACCY DIGIPOT MIKROBUS	2
101020616 Seeed	GROVE 10A DC CURRENT SENSOR	30
2331211-1 TE Connectivity AMP Connectors	2331211-1	7
MIKROE-1626 MikroElektronika	BOARD CO CARBON MONOXIDE CLICK	0
MIKROE-4145 MikroElektronika	UVB CLICK	6
101020062 Seeed	GROVE INFRARED TEMP SENSOR	12
EFX_DC_CAM_MCOAX_A Efinix, Inc.	DAUGHTER BD CSI CONNECT LEOPARD	17
D-LED-B-GEVK Sanyo Semiconductor/ON Semiconductor	EVAL BD DUAL LED BALLAST SHIELD	8
MIKROE-1135 MikroElektronika	RF TXRX MODULE WIFI TRACE ANT	0
SEN0231 DFRobot	GRAVITY: FORMALDEHYDE (HCHO) SEN	11
EVAL-CN0357-PMDZ Analog Devices, Inc.	PMOD BOARD TOXIC GAS DETECTOR	2
DEV-13674 SparkFun	PHOTON WEATHER SHIELD	7
DEV-14150 SparkFun	RELAYPLATE PI-PLATE	37
BOOSTXL-OV788ADAPT Texas Instruments	EVAL MODULE FOR OV788	3

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems