Evaluation Boards - Embedded - MCU, DSP

Image Part Number Description / PDF Quantity Rfq
YR0K50563NS010BE

YR0K50563NS010BE

Renesas Electronics America

RX63N-256K EVAL BRD

0

Y-RH850-P1XC-100PIN-PB-T1-V1

Y-RH850-P1XC-100PIN-PB-T1-V1

Renesas Electronics America

RH850/P1X-C EVAL BRD

0

YR0K50110PS000BE

YR0K50110PS000BE

Renesas Electronics America

RL78/L1C EVAL BRD

0

RTK50566T0S00000BE

RTK50566T0S00000BE

Renesas Electronics America

RSK FOR RX66T (100PIN, 64KB RAM)

0

QB-R5F100SL-TB

QB-R5F100SL-TB

Renesas Electronics America

RL78/G13 EVAL BRD

0

YSDKS7G2E40

YSDKS7G2E40

Renesas Electronics America

SYNERGY DK-S7G2

1

RTK5572MNDS00000BE

RTK5572MNDS00000BE

Renesas Electronics America

RSK FOR RX72M REST OF THE WORLD

13

Y-RH850-F1X-100PIN-PB-T1-V3

Y-RH850-F1X-100PIN-PB-T1-V3

Renesas Electronics America

RH850/F1X EVAL BRD

0

RTK0EMA170S00020BJ

RTK0EMA170S00020BJ

Renesas Electronics America

BUNDLE KIT WITH RA6T1 CPU CARD

50

QB-R5F10RLC-TB

QB-R5F10RLC-TB

Renesas Electronics America

RL78/L12 EVAL BRD

0

Y-ASK-RL78F14

Y-ASK-RL78F14

Renesas Electronics America

RL78/F14 STARTER KIT (E1 DEBUGGE

0

Y-ASK-RL78F15

Y-ASK-RL78F15

Renesas Electronics America

RL78/F15 STARTER KIT

0

RTK5RLG1P0C00000BJ

RTK5RLG1P0C00000BJ

Renesas Electronics America

RL78/G1P FAST PROTOTYPING BOARD

47

RTK7EKA2L1S00001BE

RTK7EKA2L1S00001BE

Renesas Electronics America

EK-RA2L1

49

RTK5RX23W0C01000BJ

RTK5RX23W0C01000BJ

Renesas Electronics America

TARGET BOARD FOR RX23W MODULE

0

YRTK500523TS00000BE

YRTK500523TS00000BE

Renesas Electronics America

RX23T EVAL BRD

0

RTK7910018S00000BE

RTK7910018S00000BE

Renesas Electronics America

RZ/T1 EVAL BRD

0

RTK7EKA2E1S00001BE

RTK7EKA2E1S00001BE

Renesas Electronics America

EVALUATION KIT FOR RA2E1 MCU GRO

50

R0K50562GS000BE

R0K50562GS000BE

Renesas Electronics America

RX62G EVAL BRD

0

RY9012A0000GZ00#002

RY9012A0000GZ00#002

Renesas Electronics America

RENESAS R-IN32M3 MODULE (SINGLE

20

Evaluation Boards - Embedded - MCU, DSP

1. Overview

Evaluation Boards (Dev Boards) for Embedded MCUs (Microcontroller Units) and DSPs (Digital Signal Processors) are specialized hardware platforms designed to facilitate the development, testing, and prototyping of embedded systems. These boards provide a physical environment to validate processor capabilities, peripheral integration, and software algorithms before final product deployment. They play a critical role in accelerating development cycles for applications ranging from IoT devices to industrial automation systems.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
MCU Evaluation BoardsARM Cortex-M series, integrated peripherals (UART, SPI, I2C), low-power modesSmart sensors, wearables, home automation
DSP Development KitsHigh-speed floating-point processing, SIMD instructions, real-time signal analysisAudio processing, radar systems, motor control
SoC Embedded BoardsIntegrated CPU+GPU+FPGA, multimedia acceleration, OS supportEdge computing, robotics, automotive infotainment
FPGA-based Prototyping BoardsReconfigurable logic, hardware-software co-design, high-speed I/O5G communication, AI inference accelerators

3. Structure and Components

Typical evaluation boards consist of:

  • PCB base with processor/microcontroller soldered onboard
  • Memory modules (SRAM, Flash, DDR)
  • Debugging interfaces (JTAG, SWD, UART)
  • Power management unit (voltage regulators, PMICs)
  • Peripheral connectors (GPIO, ADC/DAC, Ethernet)
  • Expansion headers for add-on modules (shields, PMODs)
  • Onboard sensors/actuators (depending on application focus)

4. Key Technical Specifications

ParameterImportance
Processor ArchitectureDetermines computational capabilities and software ecosystem compatibility
Maximum Clock FrequencyImpacts processing speed and real-time performance
Memory BandwidthAffects data throughput for signal processing applications
Peripheral IntegrationReduces external component requirements and system complexity
Power ConsumptionCritical for battery-powered and thermal-constrained applications
Debugging CapabilitiesEnables efficient firmware development and hardware verification

5. Application Fields

Key industries utilizing evaluation boards:

  • Industrial Automation: PLCs, motor drives, predictive maintenance systems
  • Consumer Electronics: Smart home devices, AR/VR headsets
  • Automotive: ADAS prototyping, ECU development
  • Medical: Portable diagnostic equipment, wearable health monitors
  • Communications: 5G baseband processing, software-defined radios
  • Energy: Smart grid controllers, solar inverters

6. Leading Manufacturers and Representative Products

ManufacturerProduct SeriesKey Features
STMicroelectronicsSTM32 Nucleo SeriesARM Cortex-M cores, Arduino compatibility, mbed OS support
Texas InstrumentsTMDX SeriesC2000 DSPs for power electronics, Code Composer Studio integration
NXP Semiconductorsi.MX RT SeriesARM Cortex-M7 based crossover processors, LCD interface support
XilinxZynq UltraScale+ MPSoCARM Cortex-A53 + FPGA fabric, AI acceleration with DPU

7. Selection Guidelines

Key considerations when choosing evaluation boards:

  • Match processor architecture to target application requirements (e.g., ARM for general-purpose, DSP for signal processing)
  • Verify peripheral compatibility with system design (number of timers, communication interfaces)
  • Assess expansion capabilities for future upgrades
  • Evaluate software toolchain maturity (IDE, compilers, RTOS support)
  • Consider power consumption specifications for end-application scenarios
  • Check available community resources and technical documentation

8. Industry Trend Analysis

Emerging trends shaping evaluation board development:

  • Increased integration of AI acceleration cores (e.g., Google Edge TPU integration)
  • Rise of RISC-V based evaluation platforms for customizable computing
  • Enhanced security features (trusted execution environments, hardware encryption)
  • Development of low-power wide-area network (LPWAN) enabled boards for IoT
  • Adoption of heterogeneous computing architectures (CPU+GPU+DSP+FPGA)
  • Cloud-connected evaluation platforms for remote testing and collaboration
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