| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
EPC |
BOARD DEMO LIDAR EPC21603 |
10 |
|
 |
EPC |
BOARD DEV FOR EPC2012 200V EGAN |
0 |
|
 |
EPC |
DEMO BD 48V - 12V 10 A BUCK CONV |
14 |
|
 |
EPC |
EVAL BOARD CLASS D WIRELESS DEMO |
4 |
|
 |
EPC |
EVAL BOARD FOR EPC2007C EPC2038 |
50 |
|
 |
EPC |
BOARD DEV EPC2055 40V EGAN FET |
39 |
|
 |
EPC |
BOARD DEV FOR EPC2001C 100V |
36 |
|
 |
EPC |
BOARD DEV FOR EPC2032 100V |
26 |
|
 |
EPC |
BOARD DEMO LIDAR EPC21601 |
28 |
|
 |
EPC |
BOARD DEV EPC2051 100V EGAN FET |
6 |
|
 |
EPC |
BOARD DEV FOR EPC2104 100V EGAN |
33 |
|
 |
EPC |
BOARD DEV FOR EPC2045 & EPC2022 |
15 |
|
 |
EPC |
EVAL DCDC 300W 1/16BRICK EPC2152 |
15 |
|
 |
EPC |
BOARD DEV FOR EPC2110 120V EGAN |
34 |
|
 |
EPC |
DEMO LIDAR 200V PULSE EPC2034C |
33 |
|
 |
EPC |
EVAL BRD 60W AMP DIFF CLASS E |
34 |
|
 |
EPC |
BOARD DEV EPC2019 EGAN FET |
15 |
|
 |
EPC |
BOARD DEV FOR EPC2007C 100V |
49 |
|
 |
EPC |
BOARD DEV FOR EPC2108 100V EGAN |
9 |
|
 |
EPC |
BOARD DEV FOR EPC2021 80V EGAN |
37 |
|
Evaluation and Demonstration Boards and Kits are hardware platforms designed to facilitate the development, testing, and demonstration of electronic systems. They serve as critical tools for engineers and developers to prototype applications, validate designs, and accelerate time-to-market. These boards integrate processors, sensors, communication interfaces, and software ecosystems, enabling rapid experimentation across diverse industries such as IoT, automotive, and industrial automation.
| Type | Functional Features | Application Examples |
|---|---|---|
| Microcontroller Development Boards | Embedded CPUs, GPIOs, integrated peripherals | IoT devices, robotics |
| FPGA Evaluation Boards | Reconfigurable logic, high-speed interfaces | Communication systems, AI accelerators |
| Sensor Expansion Kits | Multi-sensor integration (temperature, motion, etc.) | Smart agriculture, environmental monitoring |
| Wireless Communication Modules | Bluetooth/Wi-Fi/LoRa protocols, antenna interfaces | Connected healthcare, smart cities |
Typical architecture includes: - Processing Units: Microcontrollers, FPGAs, or SoCs - Memory: RAM, Flash, EEPROM - Interfaces: USB, UART, SPI, I2C, Ethernet - Power Management: Regulators, battery connectors - Software Stack: SDKs, device drivers, IDEs Physical designs often feature standardized form factors (e.g., Arduino Uno, Raspberry Pi HATs) for modular expansion.
| Parameter | Description |
|---|---|
| Processor Performance (MHz/GHz) | Determines computational capability |
| Memory Capacity (RAM/Flash) | Affects program complexity and data storage |
| Interface Types | Dictates peripheral compatibility |
| Power Consumption (mW/MHz) | Critical for battery-operated devices |
| Operating Temperature (-40 C to +85 C) | Defines environmental durability |
- Internet of Things (IoT): Smart home controllers, edge AI nodes - Automotive: ADAS sensor fusion platforms - Industrial Automation: PLC controllers, predictive maintenance systems - Consumer Electronics: Wearables, AR/VR prototypes
| Manufacturer | Representative Products |
|---|---|
| STMicroelectronics | STM32 Nucleo Series, SensorTile Kit |
| Intel | Intel Edison, Movidius Neural Compute Stick |
| Xilinx | Zynq UltraScale+ MPSoC Evaluation Kit |
| Arduino | Arduino MKR Series, Nano 33 IoT |
Key considerations: 1. Match processor capabilities to application complexity 2. Verify interface compatibility with target peripherals 3. Assess software ecosystem maturity (e.g., ROS support) 4. Evaluate power budget requirements 5. Consider long-term availability and community support
- Growing adoption of RISC-V-based evaluation platforms - Integration of AI/ML accelerators in edge computing boards - Expansion of open-source hardware ecosystems - Increased focus on energy-efficient architectures for IoT - Standardization of form factors (e.g., SparkFun's Qwiic system)