| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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THine Solutions |
EVAL BOARD KIT THC63LVDF84C |
0 |
|
 |
THine Solutions |
THCV215 EVALUATION BOARD |
0 |
|
 |
THine Solutions |
THCV236 EVALUATION BOARD |
0 |
|
 |
THine Solutions |
THCV213 EVALUATION BOARD |
0 |
|
 |
THine Solutions |
EVAL BOARD KIT THC63LVDR84C |
0 |
|
 |
THine Solutions |
THCV218 EVALUATION BOARD |
0 |
|
 |
THine Solutions |
THC63LVD1023B EVAL BOARD |
0 |
|
 |
THine Solutions |
THCV226 X2 8LANE RX EVAL BOARD |
0 |
|
 |
THine Solutions |
THC63LVD1027 EVALUATION BOARD |
0 |
|
 |
THine Solutions |
THCV231 EVALUATION BOARD |
0 |
|
 |
THine Solutions |
THCV217 EVALUATION BOARD |
0 |
|
 |
THine Solutions |
THCV216 EVALUATION BOARD |
0 |
|
 |
THine Solutions |
THCV214 EVALUATION BOARD |
0 |
|
 |
THine Solutions |
THCV241A EVALUATION BOARD FFC |
0 |
|
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THine Solutions |
THCS251 EVALUATION BOARD |
0 |
|
|
THine Solutions |
THCV233 EVALUATION BOARD |
0 |
|
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THine Solutions |
THCV244 EVALUATION BOARD SMA |
0 |
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THine Solutions |
THCV242 EVALUATION BOARD SMA |
0 |
|
|
THine Solutions |
THCV241A EVALUATION BOARD STP |
0 |
|
|
THine Solutions |
THP7312 EVALUATION BOARD |
0 |
|
Evaluation and Demonstration Boards and Kits are hardware platforms designed to facilitate the development, testing, and demonstration of electronic systems. They serve as critical tools for engineers and developers to prototype applications, validate designs, and accelerate time-to-market. These boards integrate processors, sensors, communication interfaces, and software ecosystems, enabling rapid experimentation across diverse industries such as IoT, automotive, and industrial automation.
| Type | Functional Features | Application Examples |
|---|---|---|
| Microcontroller Development Boards | Embedded CPUs, GPIOs, integrated peripherals | IoT devices, robotics |
| FPGA Evaluation Boards | Reconfigurable logic, high-speed interfaces | Communication systems, AI accelerators |
| Sensor Expansion Kits | Multi-sensor integration (temperature, motion, etc.) | Smart agriculture, environmental monitoring |
| Wireless Communication Modules | Bluetooth/Wi-Fi/LoRa protocols, antenna interfaces | Connected healthcare, smart cities |
Typical architecture includes: - Processing Units: Microcontrollers, FPGAs, or SoCs - Memory: RAM, Flash, EEPROM - Interfaces: USB, UART, SPI, I2C, Ethernet - Power Management: Regulators, battery connectors - Software Stack: SDKs, device drivers, IDEs Physical designs often feature standardized form factors (e.g., Arduino Uno, Raspberry Pi HATs) for modular expansion.
| Parameter | Description |
|---|---|
| Processor Performance (MHz/GHz) | Determines computational capability |
| Memory Capacity (RAM/Flash) | Affects program complexity and data storage |
| Interface Types | Dictates peripheral compatibility |
| Power Consumption (mW/MHz) | Critical for battery-operated devices |
| Operating Temperature (-40 C to +85 C) | Defines environmental durability |
- Internet of Things (IoT): Smart home controllers, edge AI nodes - Automotive: ADAS sensor fusion platforms - Industrial Automation: PLC controllers, predictive maintenance systems - Consumer Electronics: Wearables, AR/VR prototypes
| Manufacturer | Representative Products |
|---|---|
| STMicroelectronics | STM32 Nucleo Series, SensorTile Kit |
| Intel | Intel Edison, Movidius Neural Compute Stick |
| Xilinx | Zynq UltraScale+ MPSoC Evaluation Kit |
| Arduino | Arduino MKR Series, Nano 33 IoT |
Key considerations: 1. Match processor capabilities to application complexity 2. Verify interface compatibility with target peripherals 3. Assess software ecosystem maturity (e.g., ROS support) 4. Evaluate power budget requirements 5. Consider long-term availability and community support
- Growing adoption of RISC-V-based evaluation platforms - Integration of AI/ML accelerators in edge computing boards - Expansion of open-source hardware ecosystems - Increased focus on energy-efficient architectures for IoT - Standardization of form factors (e.g., SparkFun's Qwiic system)