Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	CY3213-16SOIC Cypress Semiconductor	KIT FLEX POD FOR CY8C21223	0
	PSU SNG12-24W Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	CY3212-32MLF2 Cypress Semiconductor	KIT FLEX POD FOR CY8C21634	0
	MB90V460CR-ES Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	CY3203-070 Cypress Semiconductor	PSOC EMU POD FT 28-SOIC 1=10PCS	0
	CY3207-060 Cypress Semiconductor	PSOC EMU POD FEET FOR 20-SSOP	0
	CY3250-64315QFN-POD Cypress Semiconductor	REPLACEMENT ICE PODS (2)	0
	CY3207-AI Cypress Semiconductor	MCU PSOC EMU POD FOR 44-TQFP	0
	CY3250-24994QFN-POD Cypress Semiconductor	KIT ICE POD FOR CY3250 QFN	0
	CY3205-S2 Cypress Semiconductor	PSOC PROGRAM BOARD MCU 28-SOIC	0
	CY3250-23X33QFN-POD Cypress Semiconductor	KIT EVAL PSOC (2) PODS	0
	CY3203-050 Cypress Semiconductor	PSOC EMU POD FT 20-SOIC/1=10PCS	0
	HQPACK120SD Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	CY3211-48SSOP Cypress Semiconductor	KIT FLEX POD FOR CY8C29X 48-SSOP	0
	CY3250-20246QFN Cypress Semiconductor	ICE POD DEBUG CY8C20246	0
	MB2132-434 Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	MB2144-223-01 Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	HQPACK064SB140 Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	CY3655-02 Cypress Semiconductor	KIT FOOT ENCORE II 40-DIP	0
	CY3205-S1 Cypress Semiconductor	PSOC PROGRAM BOARD MCU 48DIP	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization