Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	CY3655-10 Cypress Semiconductor	KIT FOOT ENCORE II 16-SOIC	0
	CY3207-PVI Cypress Semiconductor	MCU PSOC EMU POD FOR20,28,48SSOP	0
	EMA-HD-320-001 Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	SK-91460P-176PMC Cypress Semiconductor	STARTER KIT	0
	CY3664-56MLF Cypress Semiconductor	FLEX POD FOR CY7C64215-56LFXC	0
	CYUSB3ACC-003 Cypress Semiconductor	ALTERA HSMC TO EZ-USB FX3 BOARD	0
	NQPACK064SB Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	CY3692 Cypress Semiconductor	SOCKET ADAPTER FOR CY23FP12	0
	MB2144-508 Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0
	CY3212-28SSOP Cypress Semiconductor	KIT FLEX POD FOR CY8C21X 28-SSOP	0
	CY3250-LED04QFN-POD Cypress Semiconductor	REPLACEMENT ICE PODS (2)	0
	CY3083-04 Cypress Semiconductor	MATRIX CARD FOR HI-LO PROG	0
	SK-91460P-176PMC-GPIO Cypress Semiconductor	STARTER KIT	0
	CY3250-20X34QFN Cypress Semiconductor	KIT ICE POD FOR CY8C20X34 QFN	0
	CY3207-PI Cypress Semiconductor	MCU PSOC EMU POD FOR 8,28 DIP	0
	CY3208B-POD Cypress Semiconductor	MCU PSOC EMU POD FOR CY8C24XXXA	0
	CY3207-POD Cypress Semiconductor	MCU PSOC EMU POD FOR CY8C27 FAM	0
	CY3083-06 Cypress Semiconductor	MATRIX CARD FOR HI-LO PROG	0
	CY3203-095 Cypress Semiconductor	PSOC EMU POD FT 48-SSOP 1=5PCS	0
	HQ-PACK064SB140 Cypress Semiconductor	DEV KIT TOOL KIT PWR MGMT	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization