Accessories

Image Part Number Description / PDF Quantity Rfq
P0113

P0113

Terasic

PCIE X4 CABLE ADAPTER PCA

0

P0006

P0006

Terasic

BOARD ADAPTER THDB-SUM

0

P0307

P0307

Terasic

KIT DEV 4.3" LCD TOUCH PANEL

0

FPW-3006-LTE

FPW-3006-LTE

Terasic

POWER SUPPLY 12VDC 2A

0

FCB-3051-UAS

FCB-3051-UAS

Terasic

PCIE X4 GENERATION 2 CABLE

0

P0308

P0308

Terasic

BOARD ADAPTER HMSC TO GPIO

0

P0572

P0572

Terasic

DEMO PLATFORM FOR DE2-70/DE2+D5M

0

P0016

P0016

Terasic

5CH VIDEO INPUT DAUGHTER BOARD

0

P0015

P0015

Terasic

DVI TX/VGA OUT DAUGHTER BOARD

0

FCB-3096-UAS

FCB-3096-UAS

Terasic

3METER PCIEX4 GEN 2 CABLE

0

P0309

P0309

Terasic

HSMC SANTA CRUZ CONVERSION CARD

0

FCB-3095-UAS

FCB-3095-UAS

Terasic

2METER PCIEX4 GEN 2 CABLE

0

B0710

B0710

Terasic

POWER SUPPLY 12VDC US

0

P0004

P0004

Terasic

MULTIMEDIA-HSMC CARD

0

P0077

P0077

Terasic

MASS STORAGE AND VIDEO HSMC CARD

0

M0344

M0344

Terasic

SENSOR CMOS 1.3MEGA (FOR P0349)

0

B0170

B0170

Terasic

ADAPTER DC 12V/3.5A

0

P0573

P0573

Terasic

DEMO PLATFORM FOR DE1+D5M+LTM

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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