Accessories

Part Number	Description / PDF	Quantity
TMDSADP1414 Texas Instruments	ADAPTER FOR JTAG EMULATOR	3
261 Adafruit	CABLE ASSY JST PH 2PIN 4"	3649
163-062 Digilent, Inc.	FX2 SOCKET CONNECTOR HIROSE	0
350-001 Digilent, Inc.	256MB DDR DRAM FOR V2PRO	0
MIKROE-4283 MikroElektronika	PIC ICSP ADAPTER	4
MLX80104 TESTINTERFACE Melexis	INTERFACE BOARD MINIE-MLX & APPL	1
1112 Adafruit	STACKING HEADER FOR RASPBERRY PI	0
10138 Phase Dock Inc.	FEATHER OR PARTICLE MOUNTING ADA	25
STMPRIMER-PROTO STMicroelectronics	PROTOTYPE EXTENSION BOARDS, 5PCS	0
SDP-PMD-IB1Z Analog Devices, Inc.	BOARD INTERPOSER PMOD TO SDP	17
CY3280-CPM1 Cypress Semiconductor	MODULE CAPSENSE PLUS	4
CY3250-20566 Cypress Semiconductor	KIT EMULATION ICE POD PSOC DEBUG	4
PCM16YB0 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR PIC16C432	3
ADM00965 Roving Networks / Microchip Technology	CL88031 230VAC OFFLINE LED LOAD	0
MSP-FET-432ADPTR Texas Instruments	MSP432 ADAPTER FOR MSP-FET	31
MA160019 Roving Networks / Microchip Technology	PLUG-IN MODULE	8
110990038 Seeed	GROVE 4PIN CABLES 5PACK 50CM	0
CAB-17261 SparkFun	FLEXIBLE QWIIC CABLE - FEMALE JU	4
AC244062 Roving Networks / Microchip Technology	EXTENSION PAK PIC16F570	0
ATSTK521 Roving Networks / Microchip Technology	EXPANSION MODULE ATSTK500	1

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization