Terminals - Quick Connects, Quick Disconnect Connectors

Part Number	Description / PDF	Quantity
641256-1 TE Connectivity AMP Connectors	CONN QC TAB 14-18AWG 0.250 CRIMP	769
154717-7 TE Connectivity AMP Connectors	CONN QC RCPT 11-13.5AWG 0.250	5308
1217417-1 TE Connectivity AMP Connectors	CONN QC RCPT 14-18AWG 0.187	0
ED14-188-Q Panduit Corporation	STRONGHOLD FEMALE DISCONNECT, NO	4950
DPF18-250FIMB-D Panduit Corporation	CONN QC TAB 18-22AWG 0.250 CRIMP	3027
173724-1 TE Connectivity AMP Connectors	CONN QC RCPT 14-20AWG 0.187	7080
MU18-187DFK 3M	CONN QC RCPT 18-22AWG 0.187	4305
1544133-1 TE Connectivity AMP Connectors	CONN QC RCPT 10-13AWG 0.250	0
638363122007 Würth Elektronik Midcom	WR-FAST_THT MALE RIGHT ANGLED HE	100
520988-2 TE Connectivity AMP Connectors	CONN QC RCPT 18-22AWG 0.250	3795
76-IFD16-110L NTE Electronics, Inc.	PVC INS FEMALE DISCONNECT 50 BAG	3
60573-1 TE Connectivity AMP Connectors	CONN QC RCPT 20-24AWG 0.187	62167
0190170035 Woodhead - Molex	CONN QC RCPT 14-16AWG 0.187	0
60635-1 TE Connectivity AMP Connectors	CONN QC RCPT 10-14AWG 0.250	173
0190080038 Woodhead - Molex	CONN QC RCPT 12-14AWG 0.250	532
76-MD16C NTE Electronics, Inc.	NON INS MALE DISCONNECT 100 BAG	4
DPF14-250FIB-C Panduit Corporation	CONN QC RCPT 14-16AWG 0.250	69410000
0190010006 Woodhead - Molex	CONN QC TAB 14-16AWG 0.250 CRIMP	22371
521217-2 TE Connectivity AMP Connectors	CONN QC TAB 14-18AWG 0.250 CRIMP	1130
EDNF14-250FIB-Q Panduit Corporation	STRONGHOLD FEMALE DISCONNECT, NY	3133225

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

Type	Functional Features	Application Examples
Single-contact QCDs	Simple push-pull mechanism, 1-10A rating	Consumer electronics peripherals
Multicontact Array	Parallel signal/power paths, IP67 rated	Industrial automation equipment
Hydraulic Couplings	Fluid-tight sealing, 3000psi pressure	Construction machinery hydraulics
Blade Terminals	Tab-width standardized (4.8-9.5mm), vibration-resistant	Automotive electrical systems
Push-to-Connect	Self-locking collet mechanism, 0.5s engagement	Medical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

Dielectric housing (PA66, LCP, or PBT materials)
Contact elements (phosphor bronze, beryllium copper)
Retention mechanism (spring-loaded collets, detent balls)
Environmental seals (EPDM or silicone O-rings)
Strain relief components (integral cable clamps)

4. Key Technical Parameters

Parameter	Typical Range	Significance
Contact Resistance	1-10 m	Directly affects power loss
Insulation Resistance	100M -10G	Ensures circuit isolation
Operating Temperature	-55 C to +150 C	Determines environmental suitability
Insertion Force	5-50N	Impacts user experience
Durability	500-10,000 cycles	Service life indicator

5. Application Fields

Primary industries include:

Automotive (EV charging interfaces, sensor harnesses)
Aerospace (avionics rack connections)
Industrial Automation (robotic arm tooling)
Medical (patient monitoring equipment)
Telecommunications (base station RF connections)

6. Leading Manufacturers

Manufacturer	Representative Product	Key Specification
TE Connectivity	MICRO SWITCH QT	IP69K rated, 1000VAC
Molex	PicoBlade 0.8mm	0.3A contact rating
Amphenol	QCD Series 262	Hydraulic 3000psi capability
Weidm ller	OMQ Quick Connect	Vibration-proof design
Delphi	Metri-Pack 150	Automotive standard

7. Selection Guidelines

Key considerations:

Current/voltage requirements (derating factors)
Environmental protection needs (IP rating)
Engagement/disengagement frequency
Space constraints (3D footprint)
Material compatibility (corrosion resistance)
Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

Nanocoating integration for corrosion resistance
Smart connectors with embedded sensors
Miniaturization (sub-mm contact spacing)
High-temperature superconducting materials
Automated mating systems for Industry 4.0