Terminals - PC Pin Receptacles, Socket Connectors

Part Number	Description / PDF	Quantity
8252-0-15-80-30-27-10-0 Mill-Max	CONN PIN RCPT	990
712-83-129-41-001101 Preci-Dip	CONN PIN RCPT .016-.022 SOLDER	0
4034-0-15-15-23-27-04-0 Mill-Max	CONN PIN RCPT .045-.065 PRESSFIT	3841
332070 TE Connectivity AMP Connectors	CONN PIN RCPT .030-.033 SOLDER	0
8433-0-15-15-03-27-04-0 Mill-Max	CONN PIN RCPT .040-.060 PRESSFIT	22653
1-331677-4 TE Connectivity AMP Connectors	CONN PIN RCPT .030-.033 SOLDER	9991
0814-0-15-15-34-27-04-0 Mill-Max	CONN PIN RCPT .032-.046 SOLDER	2450
0355-0-15-01-02-27-10-0 Mill-Max	CONN PIN RCPT .040-.050 SOLDER	29128
0552-1-15-01-11-27-10-0 Mill-Max	CONN PIN RCPT .015-.020 SOLDER	2107
712-83-137-41-001101 Preci-Dip	CONN PIN RCPT .016-.022 SOLDER	0
0252-0-15-15-30-27-10-0 Mill-Max	CONN PIN RCPT .015-.025 HEX	8378
0354-0-15-80-02-80-10-0 Mill-Max	CONN PIN RCPT	290
712-87-147-41-001101 Preci-Dip	CONN PIN RCPT .016-.022 SOLDER	0
0335-0-15-15-47-27-04-0 Mill-Max	CONN PIN RCPT .025-.037 HEX	869
322-HCS8P2-100 TE Connectivity AMP Connectors	CONN PIN RCPT .016-.021 SOLDER	0
712-87-116-41-001101 Preci-Dip	CONN PIN RCPT .016-.022 SOLDER	0
0624-0-15-15-10-27-10-0 Mill-Max	ZERO PROFILE RECEPTACLE FOR LEAD	2453
8829-0-15-15-23-27-10-0 Mill-Max	CONN PIN RCPT .045-.065 SOLDER	1973
712-83-131-41-001101 Preci-Dip	CONN PIN RCPT .016-.022 SOLDER	0
H3169-05 Harwin	CONN PIN RCPT .035-.041 KNURL	0

Terminals - PC Pin Receptacles, Socket Connectors

1. Overview

PC Pin Receptacles and Socket Connectors are fundamental components in electronic systems, providing secure electrical connections between printed circuit boards (PCBs) and other devices. These connectors enable modular design, ease of maintenance, and reliable signal/power transmission. Their importance spans across computing, telecommunications, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Right-Angle Pin Receptacles	90 orientation for space optimization	Desktop motherboard peripheral connections
Through-Hole Socket Connectors	High mechanical stability with PCB via mounting	Industrial control panel interfaces
High-Density Array Connectors	Miniaturized contacts for compact designs	Smartphone board-to-board connections
Power Pin Receptacles	Heavy-duty contacts for high-current applications	Server power distribution units

3. Structure and Components

Typical construction includes:

Insulating housing (LCP/PBT thermoplastic materials)
Contact springs (phosphor bronze with gold plating)
Polarization keying features
PCB mounting retention mechanisms
EMI shielding layers (for high-frequency variants)

4. Key Technical Specifications

Parameter	Value Range	Importance
Current Rating	1-5A per contact	Determines power handling capacity
Contact Resistance	5-20m	Impacts signal integrity
Dielectric Withstanding Voltage	500V-1kV	Safety isolation requirement
Mating Cycles	500-10,000 cycles	Service life indicator
Operating Temperature	-55 C to +125 C	Environmental reliability

5. Application Fields

Primary industries:

Computer hardware (motherboards, GPUs)
Telecom infrastructure (5G base stations)
Automotive electronics (ECUs, sensors)
Medical devices (diagnostic equipment)
Aerospace systems (avionics modules)

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TE Connectivity	MICRO MATCH Series	0.8mm contact spacing, 3A rating
Amphenol ICC	SmartArray High-Speed Socket	10Gbps data rate capability
Molex	PicoBlade Connector System	Space-saving 1.25mm pitch design
Samtec	SEARAY High-Density Array	Up to 4,000+ contact positions

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage needs)
Environmental conditions (temperature/humidity range)
Space constraints (board layout limitations)
Service life expectations (maintenance frequency)
Compliance standards (RoHS, REACH, IPC-6012)

8. Industry Trends Analysis

Emerging developments include:

Miniaturization (sub-0.5mm contact pitch research)
High-speed signal optimization (5G/6G compatibility)
Integrated EMI shielding solutions
Advanced plating materials (nanocoatings for corrosion resistance)
Smart connector integration (embedded sensors for predictive maintenance)