Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
76314-114LF Storage & Server IO (Amphenol ICC)	CONN RCPT 28POS 0.1 GOLD PCB	100
20021311-00044T4LF Storage & Server IO (Amphenol ICC)	CONN RCPT 44POS 0.05 GOLD PCB	0
20021311-00008T1LF Storage & Server IO (Amphenol ICC)	CONN RCPT 8POS 0.05 GOLD PCB	2220
68683-310LF Storage & Server IO (Amphenol ICC)	CONN RCPT 20POS 0.1 GOLD PCB	152
71991-805LF Storage & Server IO (Amphenol ICC)	CONN RCPT 10POS 0.1 GOLD PCB	644
68683-305LF Storage & Server IO (Amphenol ICC)	CONN RCPT 10POS 0.1 GOLD PCB	2469
75915-303LF Storage & Server IO (Amphenol ICC)	CONN RCPT 3POS 0.1 GOLD PCB	1441
68685-310LF Storage & Server IO (Amphenol ICC)	CONN RCPT 10POS 0.1 GOLD PCB	1217
71991-804HLF Storage & Server IO (Amphenol ICC)	CONN RCPT 8POS 0.1 GOLD PCB	0
68685-320LF Storage & Server IO (Amphenol ICC)	CONN RCPT 20POS 0.1 GOLD PCB	1372
76341-307LF Storage & Server IO (Amphenol ICC)	CONN RCPT 7POS 0.1 GOLD PCB	283
20021321-00014C1LF Storage & Server IO (Amphenol ICC)	CONN RCPT 14POS 0.05 GOLD SMD	633
71991-313LF Storage & Server IO (Amphenol ICC)	CONN RCPT 26POS 0.1 GOLD PCB	235
55508-130LF Storage & Server IO (Amphenol ICC)	CONN RCPT 30POS 0.079 GOLD SMD	0
55510-118LF Storage & Server IO (Amphenol ICC)	CONN RCPT 18POS 0.079 GOLD SMD	0
68685-316LF Storage & Server IO (Amphenol ICC)	CONN RCPT 16POS 0.1 GOLD PCB	2484
87606-314LF Storage & Server IO (Amphenol ICC)	CONN RCPT 28POS 0.1 GOLD PCB	0
91618-325LF Storage & Server IO (Amphenol ICC)	CONN RCPT 50POS 0.1 GOLD SMD	144
68685-308LF Storage & Server IO (Amphenol ICC)	CONN RCPT 8POS 0.1 GOLD PCB	275
63453-132LF Storage & Server IO (Amphenol ICC)	CONN RCPT 32POS 0.079 GOLD PCB	0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers