Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
M55-6002042R Harwin	CONN RCPT 20POS 0.05 GOLD SMD	715
M22-7140842 Harwin	CONN RCPT 16POS 0.079 GOLD PCB	175
M22-7142042 Harwin	CONN RCPT 40POS 0.079 GOLD PCB	244
G125-FV12605F1P Harwin	CONN RCPT 26POS 0.049 GOLD PCB	46
M80-8871201 Harwin	CONN RCPT 12POS 0.079 GOLD PCB	0
M50-3121045 Harwin	CONN RCPT 20POS 0.05 GOLD SMD	959
M80-4122042 Harwin	CONN RCPT 20POS 0.079 GOLD SMD	0
M80-8870405 Harwin	CONN RCPT 4POS 0.079 GOLD PCB	274
M80-8871005 Harwin	CONN RCPT 10POS 0.079 GOLD PCB	592
M83-LFT1F2N27-0000-000 Harwin	CONN RCPT 27POS 0.079 GOLD PCB	6
G125-FS12005L0P Harwin	CONN RCPT 20POS 0.049 GOLD SMD	1656
G125-FV13405L0P Harwin	CONN RCPT 34POS 0.049 GOLD PCB	161
M20-7881646 Harwin	CONN RCPT 32POS 0.1 TIN PCB R/A	71
M20-7830542 Harwin	CONN RCPT 10POS 0.1 GOLD PCB	0
M80-8501042 Harwin	CONN RCPT 10POS 0.079 GOLD PCB	114
G125-FS10605F3P Harwin	CONN RCPT 6POS 0.049 GOLD SMD	104
M50-3130345 Harwin	CONN RCPT 3POS 0.05 GOLD SMD	1452
G125-FV11005F1P Harwin	CONN RCPT 10POS 0.049 GOLD PCB	297
M20-7830342 Harwin	CONN RCPT 6POS 0.1 GOLD PCB	125
M20-7833646 Harwin	CONN RCPT 72POS 0.1 TIN PCB	0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers