Rectangular Connectors - Headers, Receptacles, Female Sockets

Image Part Number Description / PDF Quantity Rfq
0447691603

0447691603

Woodhead - Molex

CONN RCPT 16POS 0.118 GOLD PCB

0

0009483155

0009483155

Woodhead - Molex

CONN RCPT 15P 0.156 GOLD EDGE MT

992

0872643052

0872643052

Woodhead - Molex

CONN RCPT 30P 0.079 GOLD PCB R/A

0

0872642052

0872642052

Woodhead - Molex

CONN RCPT 20P 0.079 GOLD PCB R/A

4076

0448120025

0448120025

Woodhead - Molex

CONN RCPT 7POS 0.1 GOLD PCB

0

5023861570

5023861570

Woodhead - Molex

CONN RCPT 15P 0.049 TIN SMD R/A

989

5025840360

5025840360

Woodhead - Molex

CONN RCPT 3POS 0.059 TIN SMD

8556

0901471102

0901471102

Woodhead - Molex

CONN RCPT 2POS 0.1 TIN PCB

5732

5023820471

5023820471

Woodhead - Molex

CONN RCPT 4POS 0.049 GOLD SMD

0

0448120021

0448120021

Woodhead - Molex

CONN RCPT 3POS 0.1 GOLD PCB

632

0022152076

0022152076

Woodhead - Molex

CONN RCPT 7POS 0.1 TIN EDGE MNT

1679

0022027043

0022027043

Woodhead - Molex

CONN RCPT 4POS 0.1 TIN PCB

643

5025840860

5025840860

Woodhead - Molex

CONN RCPT 8POS 0.059 TIN SMD

0

0009484129

0009484129

Woodhead - Molex

CONN RCPT 12POS 0.156 TIN PCB

0

0901471108

0901471108

Woodhead - Molex

CONN RCPT 8POS 0.1 TIN PCB

1517

0447691801

0447691801

Woodhead - Molex

CONN RCPT 18POS 0.118 TIN PCB

0

5024430270

5024430270

Woodhead - Molex

CONN RCPT 2POS 0.079 TIN SMD

3217

0010181091

0010181091

Woodhead - Molex

CONN HDR 9POS 0.198 TIN PCB

0

0009484059

0009484059

Woodhead - Molex

CONN RCPT 5POS 0.156 TIN PCB

1157

0447690602

0447690602

Woodhead - Molex

CONN RCPT 6POS 0.118 GOLD PCB

5149

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Single-Row HeadersLinear arrangement of male pinsArduino shields, sensor modules
Double-Row HeadersDual-row pin configuration for higher densityComputer motherboards, industrial controllers
Right-Angle Receptacles90 orientation for space-constrained designsCompact medical devices, automotive sensors
Stacking Female SocketsVertical interconnection for multi-board systems3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

  • Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
  • Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
  • Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
  • Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

ParameterValue/RangeImportance
Current Rating0.5A - 10A per contactDetermines power transmission capacity
Contact Resistance5-20m Affects signal integrity and thermal performance
Dielectric Strength500V - 2500V ACEnsures electrical safety and insulation reliability
Operating Temperature-55 C to +125 CDefines environmental tolerance
Mating Cycles100 - 10,000 cyclesIndicates mechanical durability

5. Application Fields

  • Consumer Electronics: Smartphones, laptops, gaming consoles
  • Industrial Automation: PLCs, motor drives, sensor hubs
  • Telecommunications: 5G base stations, network routers
  • Medical Devices: Diagnostic equipment, patient monitors
  • Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityMicroSpeed Rectangular Connectors
MolexPicoBlade 0.8mm Headers
AmphenolMICRO CONECTA Surface Mount Sockets
SamtecQTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage levels)
  • PCB space constraints and stacking needs
  • Environmental factors (temperature, vibration, moisture)
  • Cost-effectiveness vs. long-term reliability
  • Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

  • Miniaturization: Sub-1.0mm pitch connectors for wearable devices
  • High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
  • Enhanced reliability: Hermetic sealing for aerospace applications
  • Modular designs: Tool-less hot-swap systems for data centers
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